10AX090R2F40E2SG vs 10AX090R3F40E2LG Comparación
Comparación detallada lado a lado de 10AX090R2F40E2SG por Intel y 10AX090R3F40E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090R2F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.750,00 | $5.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | 900,000 |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | 342 |
| Package Type | 1517-BBGA, FCBGA | Flip-Chip Ball Grid Array |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | — |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | — |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | Multi-gigabit serial transceivers (on-die) |
| DSP Blocks | Variable-precision, hardened floating-point capable | Hardened fixed/floating-point DSP blocks (on-die) |
| Process Node | TSMC 20nm | — |
| Tipo de montaje | Surface Mount (FCBGA ball grid) | Surface Mount |
| Nivel MSL | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Embedded Memory | — | 59,234,304 bits |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| Encapsulado | — | 1517-Ball FCBGA |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |
| Estado RoHS | — | Compliant |