10AX090R2F40E2SG vs 10AX090R3F40E2LG 对比
详细并排对比 10AX090R2F40E2SG 出自 Intel 和 10AX090R3F40E2LG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AX090R2F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $4,750.00 | $5,750.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | 900,000 |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | 342 |
| Package Type | 1517-BBGA, FCBGA | Flip-Chip Ball Grid Array |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | — |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | — |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | Multi-gigabit serial transceivers (on-die) |
| DSP Blocks | Variable-precision, hardened floating-point capable | Hardened fixed/floating-point DSP blocks (on-die) |
| Process Node | TSMC 20nm | — |
| 安装类型 | Surface Mount (FCBGA ball grid) | Surface Mount |
| MSL 等级 | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Embedded Memory | — | 59,234,304 bits |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| 封装 | — | 1517-Ball FCBGA |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |
| RoHS 状态 | — | Compliant |