10AX115H3F34E2LG vs 10AX115H2F34E2SG Vergleich
Detaillierter Direktvergleich von 10AX115H3F34E2LG von Intel und 10AX115H2F34E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115H3F34E2LG | 10AX115H2F34E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.550,00 | $5.500,00 |
| Family | Arria 10 GX | — |
| Series | 10AX115 | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits (67.7 Mbit) | — |
| User I/O Count | 504 | — |
| Transceivers | Up to 17.4 Gbps (per Arria 10 datasheet) | 24 channels up to 14.1 Gbps |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller | — |
| DSP Blocks | Variable-precision DSP (per Arria 10 datasheet) | Hardened IEEE 754 single/double-precision floating-point |
| Process Technology | 20 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | E2 (commercial, mid-speed) | — |
| Gehäuse | 1152-ball FCBGA (F34), 1.0 mm pitch | 1152-ball FCBGA (F34) 35x35 mm |
| Betriebstemperatur | 0C to +100C (commercial) | — |
| Montageart | Surface Mount (BGA, reflow) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | — |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory (M20K blocks) | — | 2,713 blocks / 68,857,600 bits |
| User I/O Pins | — | 504 |
| PCIe Hard IP | — | Gen3 x4 / Gen2 x8 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| 18x19 Multipliers | — | 2,150 |
| PLLs | — | Fractional, up to 24 |
| Memory Interfaces | — | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 |
| Speed/Operating Temperature Grade | — | -2 / 0 C to 100 C (E2 = industrial, enhanced) |
| Process Node | — | 20 nm Tri-Gate (Intel) |