10AX115H3F34E2LG vs 10AX115H2F34E2SG 비교
다음의 상세 나란히 비교: 10AX115H3F34E2LG 제조: Intel 및 10AX115H2F34E2SG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AX115H3F34E2LG | 10AX115H2F34E2SG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $6,550.00 | $5,500.00 |
| Family | Arria 10 GX | — |
| Series | 10AX115 | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits (67.7 Mbit) | — |
| User I/O Count | 504 | — |
| Transceivers | Up to 17.4 Gbps (per Arria 10 datasheet) | 24 channels up to 14.1 Gbps |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller | — |
| DSP Blocks | Variable-precision DSP (per Arria 10 datasheet) | Hardened IEEE 754 single/double-precision floating-point |
| Process Technology | 20 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | E2 (commercial, mid-speed) | — |
| 패키지 | 1152-ball FCBGA (F34), 1.0 mm pitch | 1152-ball FCBGA (F34) 35x35 mm |
| 동작 온도 | 0C to +100C (commercial) | — |
| 실장 유형 | Surface Mount (BGA, reflow) | Surface Mount (BGA) |
| RoHS 상태 | Compliant | Compliant |
| MSL 레벨 | MSL3 (per JEDEC J-STD-020) | — |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory (M20K blocks) | — | 2,713 blocks / 68,857,600 bits |
| User I/O Pins | — | 504 |
| PCIe Hard IP | — | Gen3 x4 / Gen2 x8 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| 18x19 Multipliers | — | 2,150 |
| PLLs | — | Fractional, up to 24 |
| Memory Interfaces | — | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 |
| Speed/Operating Temperature Grade | — | -2 / 0 C to 100 C (E2 = industrial, enhanced) |
| Process Node | — | 20 nm Tri-Gate (Intel) |