10AX115N2F45E2LG vs 10AX115N4F45E3LG Vergleich
Detaillierter Direktvergleich von 10AX115N2F45E2LG von Intel und 10AX115N4F45E3LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115N2F45E2LG | 10AX115N4F45E3LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.580,55 | $7.100,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| Embedded Memory | 68,857,856 bits (M20K + MLAB) | 68,857,856 bits (8,532 Kbits per M20K block) |
| DSP Blocks | [DATA_NEEDED: DSP count] | 3,376 (variable-precision, 18x19 multipliers) |
| User I/O Pins | 768 | — |
| Maximum Transceiver Data Rate | 28.05 Gbps | — |
| Transceivers | [DATA_NEEDED: number of transceivers] | Up to 96 channels at up to 17.4 Gbps |
| Process Technology | 20 nm TSMC | TSMC 20nm |
| Core Voltage | 0.9 V | — |
| Gehäuse | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45, 45x45 mm) |
| Hard Processor System (HPS) | Not included (GX variant, no HPS) | — |
| Betriebstemperatur | [DATA_NEEDED: temperature grade] | Extended (E) industrial grade per ordering code |
| Configuration Memory | Embedded SRAM-based, requires external boot flash | — |
| RoHS-Status | Compliant | Compliant |
| Development Tool | Intel Quartus Prime | — |
| Maximum User I/O Pins | — | 768 |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore |
| Memory Interfaces | — | DDR4, DDR3, QDR-IV, RLDRAM III (hard controller) |
| PCIe Hard IP | — | PCIe Gen3 x8 (hard IP block) |
| PLLs | — | 24 |
| Montageart | — | Surface Mount (BGA) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Voltage Rails | — | Core 0.9 V, transceiver 1.0/1.1 V, I/O bank-dependent |