10AX115N2F45E2LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
Teilenummer: 10AX115N2F45E2LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9483.69 | $9.483,69 |
| 10 | $9105 | $91.050,00 |
| 100 | $8535.32 | $853.532,00 |
| 500 | $8056.14 | $4.028.070,00 |
| 1.000 | $7580.55 | $7.580.550,00 |
10AX115N2F45E2LG Übersicht
What is an Arria 10 GX FPGA? An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement custom digital hardware. The Arria 10 GX family sits in the mid-range of Intel's FPGA portfolio (positioned between low-power Cyclone and high-end Stratix), combining transceivers up to 28.05 Gbps, hard memory controllers, variable-precision DSP blocks, and the option of an ARM-based Hard Processor System (HPS) for SoC variants. The 10AX115N2F45E2LG is the logic-only GX variant without an integrated HPS.
Key features of the 10AX115N2F45E2LG include 1,150,000 logic elements, 68.86 Mbits of on-chip embedded memory (M20K + MLAB), 28.05 Gbps transceivers for high-speed serial links, 3036 DSP blocks for fixed- and floating-point signal processing, and 768 user I/O. The 1932-ball FCBGA (F45 package designation) provides ample signal escape for the high I/O count and transceiver bandwidth, while the 0.9 V core voltage (with 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V I/O standards) supports modern low-power system designs.
Architecturally, the Arria 10 GX family uses a heterogeneous fabric combining Adaptive Logic Modules (ALMs), M20K SRAM blocks, MLABs, and DSP blocks. Hard IP blocks include PCI Express Gen3 controllers, external memory interfaces (DDR4, DDR3, QDRIV, RLDRAM3), and up to 24 full-duplex transceivers. The 20 nm process enables lower core power than the previous 28 nm Arria V, making the device attractive for power-constrained 100G and 400G wireline, broadcast video, military radar, and test & measurement applications.
Typical applications include high-speed serial protocol bridging (PCI Express Gen3, 10/40/100 Gigabit Ethernet, CPRI, JESD204B/C), 4K/8K video processing pipelines, software-defined radio (SDR) baseband processing, and DSP-intensive test and measurement equipment. The 28.05 Gbps transceivers allow direct connection to QSFP+/QSFP28 optical modules, while the hard PCIe Gen3 controllers enable accelerator and co-processor cards.
When designing with this FPGA, ensure the 1932-FCBGA PCB footprint has the correct BGA pitch and stackup, provide sufficient decoupling for the 0.9 V core rail, and use Intel Quartus Prime for synthesis, place-and-route, and timing closure. For thermal management, the high power envelope of dense designs typically requires forced-air cooling or a heatsink.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für 10AX115N2F45E2LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115N2F45E2LG (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Embedded Memory, Mounting Type, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115N2F45E1SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6240 / Stück
Datenblatt ansehen →10AX115N2F45I2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5760 / Stück
Datenblatt ansehen →10AX115N2F45I2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8750 / Stück
Datenblatt ansehen →10AX115N2F45E2LG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory | 68,857,856 bits (M20K + MLAB) |
| User I/O Pins | 768 |
| Maximum Transceiver Data Rate | 28.05 Gbps |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Gehäuse | 1932-ball FCBGA (F45) |
| Hard Processor System (HPS) | Not included (GX variant, no HPS) |
| Configuration Memory | Embedded SRAM-based, requires external boot flash |
| RoHS-Status | Compliant |
| Development Tool | Intel Quartus Prime |
10AX115N2F45E2LG 1932-ball fcbga (f45) Pinbelegungsleitfaden
Pinbelegung für 10AX115N2F45E2LG (1932-ball fcbga (f45)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115N2F45E2LG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115N2F45E2LG ist geeignet für 6 Anwendungs: 100G Ethernet Aggregation / Packet Processing, 4K/8K Video Processing and Broadcast, Software Defined Radio (SDR) Baseband Processing, Test & Measurement Instrumentation, PCI Express Accelerator Cards, Medical Imaging and Diagnostic Equipment.
100G Ethernet Aggregation / Packet Processing
The 10AX115N2F45E2LG is well-suited for 100G Ethernet aggregation line cards and packet processing engines. With 28.05 Gbps transceivers, the device can directly interface QSFP28 optical modules for four-lane 25 Gbps CAUI-4 or single-lane 100G configurations. The 1,150,000 logic elements provide ample capacity for wire-speed packet parsing, classification, and forwarding pipelines, while the 3036 DSP blocks accelerate hashing and encryption operations on every packet. Combined with hard 100G MAC and PCS IP cores in Quartus Prime, this FPGA eliminates discrete switch ASICs in mid-range aggregation designs.
Empfohlen
4K/8K Video Processing and Broadcast
The 10AX115N2F45E2LG targets professional broadcast and studio 4K/8K video processing pipelines. The combination of 1,150,000 logic elements and 3036 DSP blocks supports multi-channel HEVC/H.264 codec instances at 60 fps, while the high I/O count (768 user I/O) accommodates multiple 12G-SDI / Quad-Link 3G-SDI inputs and outputs. The hard memory controllers deliver up to DDR4-2400 throughput for frame buffer management, and the 28.05 Gbps transceivers enable SMPTE 2022-6 / 2110 IP-based broadcast transport. Quartus Prime provides reference designs for 12G-SDI gearbox and HDR processing pipelines.
Empfohlen
Software Defined Radio (SDR) Baseband Processing
The 10AX115N2F45E2LG provides the DSP throughput required for wideband SDR baseband processing in military and commercial wireless systems. The 3036 variable-precision DSP blocks can implement multi-antenna beamforming, FFT/iFFT for OFDM modulation, and channelisation filters for 100+ MHz instantaneous bandwidth signals. The 28.05 Gbps transceivers interface directly to ADC/DAC devices (such as TI ADC32RF45) via JESD204B/C, while 768 user I/O pins allow parallel GPIO control of RF front-end tuning. Hard PCIe Gen3 controllers enable host interface to general-purpose processors for hybrid CPU+FPGA SDR architectures.
Empfohlen
Test & Measurement Instrumentation
The 10AX115N2F45E2LG enables high-performance test and measurement equipment such as oscilloscopes, BERT (bit-error-rate testers), and arbitrary waveform generators. The combination of high logic density and 28.05 Gbps transceivers allows real-time processing of multi-GSample/s ADC data streams, while the 3036 DSP blocks accelerate FFT-based spectrum analysis and trigger detection algorithms. The 768 I/O pins provide generous test points and front-panel interface connectivity. Hard DDR4 controllers manage deep acquisition memory, and Quartus Prime's DSP Builder accelerates MATLAB-derived signal processing model integration.
Empfohlen
PCI Express Accelerator Cards
The 10AX115N2F45E2LG is a strong candidate for PCIe Gen3 x8 accelerator cards used in data center acceleration workloads. Hard PCI Express Gen3 controllers with integrated transceivers enable up to 8 GB/s host-to-FPGA throughput, while the 1,150,000 logic elements and 3036 DSP blocks accelerate database query, machine learning inference, and video transcoding workloads. The 768 user I/O pins support DDR4 expansion memory and external storage interfaces (NVMe, SATA). Quartus Prime provides reference designs for OpenCL, HLS, and oneAPI toolchains targeting Intel FPGAs for data center use.
Empfohlen
Medical Imaging and Diagnostic Equipment
The 10AX115N2F45E2LG supports advanced medical imaging modalities including ultrasound, CT, and MRI signal processing. The 1,150,000 logic elements enable real-time beamforming for 256-channel ultrasound systems, while 3036 DSP blocks accelerate 3D image reconstruction algorithms. The 768 I/O pins interface to high-speed ADC front-ends, and the 28.05 Gbps transceivers enable high-bandwidth data export to host processors. Industrial temperature grade variants (10AX115N2F45I2LG) support deployment in clinical environments, while Quartus Prime's functional safety documentation assists IEC 62304 / IEC 60601 compliance workflows.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115N2F45E2LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115N2F45E1SG | 10AX115N2F45I2SG | 10AX115N2F45I2LG |
|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 (same) | 1,150,000 (same) | 1,150,000 (same) |
| User I/O | 768 | 768 (same) | 768 (same) | 768 (same) |
| Speed Grade | E2 | E1 (slower) | I2 (industrial) | I2 (industrial) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Process Technology | 20 nm TSMC | 20 nm TSMC (same) | 20 nm TSMC (same) | 20 nm TSMC (same) |
| Transceiver Max Data Rate | 28.05 Gbps | 28.05 Gbps (same) | 28.05 Gbps (same) | 28.05 Gbps (same) |
| Hard Processor System (HPS) | No (GX logic-only) | No (GX) | No (GX) | No (GX) |
| Approximate Unit Price (qty 1) | $9,483.69 | Lower (slower speed grade discount) | Higher (industrial premium) | Higher (industrial premium) |
Wichtigste Unterscheidungsmerkmale
- Highest density Arria 10 GX variant in the F45 1932-ball package (vs. 10AX115H2F34E2LG)
- E2 speed grade for highest Fmax in the Arria 10 GX F45 family (vs. 10AX115N2F45E1SG)
- 28.05 Gbps transceivers support 100G Ethernet natively (vs. 10AX115N2F40I1SG)
Designhinweise
The 10AX115N2F45E2LG Arria 10 GX FPGA in the 1932-ball FCBGA package can dissipate 20-40 W depending on logic utilisation, transceiver activation, and clocking rate. Estimated: at 80% logic utilisation, 16 active transceivers at 10 Gbps, and DDR4 memory interface active, expect approximately 25 W power dissipation. The FCBGA package requires a heatsink or cold-plate attachment; thermal resistance theta_JA is approximately 1.5-2.5 C/W with a high-performance thermal interface material (TIM) and adequate airflow (>200 LFM). Always run Intel Quartus Prime's PowerPlay analyser for design-specific thermal estimates.
The 1932-ball FCBGA F45 package uses a 1.0 mm ball pitch, requiring HDI PCB technology (microvia stackups). Layer count: minimum 12 layers with 4-2-4 or 5-2-5 stackup recommended for signal integrity on 28.05 Gbps transceivers. Decoupling requires 0402/0201 ceramic capacitors placed directly under the BGA balls, plus bulk capacitors on the 0.9 V core rail. Intel provides package-specific breakout and routing guidelines in the Arria 10 GX layout documentation.
Common design pitfalls with the 10AX115N2F45E2LG include: (1) underestimating transceiver reference clock jitter - use low-jitter oscillators such as the SiTime SiT9121 or equivalent; (2) ignoring configuration scheme - this Arria 10 device uses SRAM-based configuration requiring an external boot flash (such as EPCQ-L256) for non-volatile bitstream storage; (3) over-constraining timing - the 28.05 Gbps transceivers require careful attention to PCB channel loss and equalisation settings; (4) failing to verify HPS-less (GX) variant boot mode versus SoC variants. Always review the Intel Arria 10 GX errata and design checklist before tape-out.
PCB layout for the 10AX115N2F45E2LG requires strict adherence to Intel's pin-out file and BGA breakout guidelines. Transceiver channels should be routed with controlled impedance (100 ohm differential) and length-matched within the tolerance specified in the transceiver user guide. Power plane segmentation is critical: separate planes for 0.9 V core, 1.2 V/1.5 V/1.8 V I/O banks, and 2.5 V/3.3 V auxiliary supplies prevent cross-supply noise coupling. Use the Quartus Prime pin planner to assign I/O standards and bank voltages correctly before PCB layout finalisation.
Compliance-Informationen
RoHS compliance per Intel/Altera product page. AEC-Q100 not applicable for FPGA (industrial -40C to +100C variants available as separate ordering codes). Lead-free packaging standard. Conflict minerals compliance per Intel's CMRT filings.