10AX115N3F45E2LG vs 10AX115N4F45E3LG Vergleich
Detaillierter Direktvergleich von 10AX115N3F45E2LG von Intel und 10AX115N4F45E3LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115N3F45E2LG | 10AX115N4F45E3LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.325,00 | $7.100,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits (8,532 Kbits per M20K block) |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| User I/O Count | 768 | — |
| Transceiver Data Rate (max) | 28.05 Gbps | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 3,376 (variable-precision, 18x19 multipliers) |
| Process Technology | 20 nm | TSMC 20nm |
| Core Voltage | 0.9 V | — |
| Operating Temperature Grade | Extended (E2) | — |
| Gehäuse | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45, 45x45 mm) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Maximum User I/O Pins | — | 768 |
| Transceivers | — | Up to 96 channels at up to 17.4 Gbps |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore |
| Memory Interfaces | — | DDR4, DDR3, QDR-IV, RLDRAM III (hard controller) |
| PCIe Hard IP | — | PCIe Gen3 x8 (hard IP block) |
| PLLs | — | 24 |
| Betriebstemperatur | — | Extended (E) industrial grade per ordering code |
| Voltage Rails | — | Core 0.9 V, transceiver 1.0/1.1 V, I/O bank-dependent |