10AX115R1F40E1SG vs 10AX115R3F40E2SG Vergleich
Detaillierter Direktvergleich von 10AX115R1F40E1SG von Intel und 10AX115R3F40E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115R1F40E1SG | 10AX115R3F40E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $4.925,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| Embedded Memory | 68,857,560 bits (68.86 Mbit) | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | [DATA_NEEDED: M20K count] | 2,738 |
| DSP Blocks | 342 | 1,518 (variable-precision, hard FP) |
| DSP Format | Variable-precision (fixed/floating-point) | — |
| Transceivers | [DATA_NEEDED: transceiver count for 10AX115 F40] | — |
| Transceiver Max Data Rate | 14.4 Gbps | — |
| Hard PCIe Cores | PCIe Gen3 x8 | — |
| Hard Memory Controllers | 2 | DDR4/DDR3/QDR IV |
| Maximum User I/O | 768 | 342 |
| Process Technology | 20 nm TSMC | TSMC 20 nm |
| Core Voltage | 0.9 V | — |
| Speed Grade | R1 (commercial) | -2 |
| Temperature Grade | E1 (enhanced) | E2 (0C to +100C) |
| Gehäuse | 1517-BBGA / FCBGA (F40), 40 x 40 mm | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Montageart | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS-Status | Compliant | Compliant |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Configuration Memory | — | Embedded (no external flash required for typical use) |