10AX115R1F40E1SG vs 10AX115R3F40E2SG Comparación
Comparación detallada lado a lado de 10AX115R1F40E1SG por Intel y 10AX115R3F40E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115R1F40E1SG | 10AX115R3F40E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $4.925,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| Embedded Memory | 68,857,560 bits (68.86 Mbit) | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | [DATA_NEEDED: M20K count] | 2,738 |
| DSP Blocks | 342 | 1,518 (variable-precision, hard FP) |
| DSP Format | Variable-precision (fixed/floating-point) | — |
| Transceivers | [DATA_NEEDED: transceiver count for 10AX115 F40] | — |
| Transceiver Max Data Rate | 14.4 Gbps | — |
| Hard PCIe Cores | PCIe Gen3 x8 | — |
| Hard Memory Controllers | 2 | DDR4/DDR3/QDR IV |
| Maximum User I/O | 768 | 342 |
| Process Technology | 20 nm TSMC | TSMC 20 nm |
| Core Voltage | 0.9 V | — |
| Speed Grade | R1 (commercial) | -2 |
| Temperature Grade | E1 (enhanced) | E2 (0C to +100C) |
| Encapsulado | 1517-BBGA / FCBGA (F40), 40 x 40 mm | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Estado RoHS | Compliant | Compliant |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Configuration Memory | — | Embedded (no external flash required for typical use) |