10AX115R3F40E2LG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel / Altera
Teilenummer: 10AX115R3F40E2LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1725 | $17.250,00 |
| 100 | $1605 | $160.500,00 |
| 500 | $1510 | $755.000,00 |
| 1.000 | $1425 | $1.425.000,00 |
10AX115R3F40E2LG Übersicht
An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. In the broader taxonomy, the 10AX115R3F40E2LG belongs to: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Arria 10 is positioned as Intel's mid-range, transceiver-rich FPGA family optimized for high-bandwidth signal processing, data acquisition, and protocol bridging between ASIC/ASSP devices.
Key features of this variant include the GX transceiver tile block (up to 28.05 Gbps transceivers), a hard PCIe Gen3 / Gen2 controller IP block, 1,150,000 logic elements for parallel DSP and datapath processing, 1,518 DSP blocks for fixed/floating-point operations, and 68,857,856 embedded-memory bits distributed across M20K block RAMs and MLABs. It targets transceiver rates from 1 Gbps up to 28.05 Gbps depending on protocol (PCIe Gen3, 10G/40G Ethernet, CPRI, Interlaken, JESD204B).
Typical applications include 100G/40G line-card packet processing, high-end medical imaging (CT, MRI, ultrasound front-end DSP), radar signal processing, software-defined radio baseband, test & measurement digitizer back-ends, and high-resolution video broadcast. The wide transceiver bandwidth also makes the Arria 10 GX 1150K the device of choice for ASIC prototyping where >1 MLE and high I/O count are both required.
When designing with this device, plan PCB layout carefully for the 1517-ball FCBGA package: BGA break-out requires microvia or via-in-pad stack-ups, and length-matched routing for the GTx transceivers is mandatory for 25 Gbps+ links. Use Intel Quartus Prime Pro for synthesis, place-and-route, and timing closure.
This page synthesizes distributor stock from DigiKey/Mouser/Octopart, design-in guidance for transceiver-based applications, and same-family Arria 10 alternatives not listed in stock feeds.
Drop-in-Alternativen für 10AX115R3F40E2LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115R3F40E2LG (gleiche Bauform und Footprint) – abweichend in Package, Temperature Grade, Family, DSP Blocks, Process Node.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115R3F40E2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4925 / Stück
Datenblatt ansehen →10AX115R2F40E2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$10300 / Stück
Datenblatt ansehen →10AX115R4F40E2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AX115R2F40I2LG
✅ Drop-In✓ Auf Lager
$4310 / Stück
Datenblatt ansehen →10AX115R2F40I2SG
✅ Drop-In✓ Auf Lager
$7189.2 / Stück
Datenblatt ansehen →10AX115R2F40E2SG
✅ Drop-In✓ Auf Lager
$5410 / Stück
Datenblatt ansehen →10AX115R3F40E2LG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Product Type | FPGA (Field Programmable Gate Array) |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| DSP Blocks | 1,518 (with integrated hard floating-point) |
| Maximum User I/O | 342 |
| Number of Pins / Balls | 1517 |
| Package Type | FC-FBGA (flip-chip fine-pitch BGA) |
| Process Node | 20 nm |
| Core Voltage | 0.9 V |
| Maximum Transceiver Data Rate | 28.05 Gbps |
| Hard Memory Controller | Yes (DDR4/DDR3/QDR IV) |
| Hard PCIe Controller | Yes (PCIe Gen3 x8 hard IP) |
| Betriebstemperatur | -40 C to +100 C (extended) |
| Temperature Grade | Extended (E) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Programming Tool | Intel Quartus Prime Pro / Standard |
10AX115R3F40E2LG fc-fbga (flip-chip fine-pitch bga) Pinbelegungsleitfaden
Pinbelegung für 10AX115R3F40E2LG (fc-fbga (flip-chip fine-pitch bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115R3F40E2LG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115R3F40E2LG ist geeignet für 7 Anwendungs: 100G/40G Ethernet Line Card Packet Processing, Medical Imaging DSP Front-End (CT / MRI / Ultrasound), Radar Signal Processing (Phased Array / EW), Software Defined Radio Baseband, Test & Measurement Digitizer Back-End, ASIC Prototyping (Mid-to-Large Designs), Broadcast Video Processing (4K/UHD).
100G/40G Ethernet Line Card Packet Processing
The 10AX115R3F40E2LG is well-suited for 100G/40G Ethernet line cards because its GTx transceivers natively support 28.05 Gbps CAUI-4 lanes and its 1.15 MLE provides ample logic for packet classification, hierarchical QoS, and policing. Its 68.8 Mb embedded memory absorbs short bursts without DDR4 round-trips, dropping average latency under load. The hard PCIe Gen3 x8 IP accelerates the host-CPU DMA channel for north-bound traffic. Designers typically pair it with external 25G Ethernet PHY / MAC partners when line-side serDes are needed beyond 28 Gbps. Power dissipation at full transceiver load is high; an enclosure-mounted heatsink or cold plate is required for sustained 100G operation.
Empfohlen
Medical Imaging DSP Front-End (CT / MRI / Ultrasound)
The 10AX115R3F40E2LG fits medical-imaging front-end DSP where 1,518 hard floating-point DSP blocks enable real-time beamforming for ultrasound, real-time Fourier reconstruction for MRI, and back-projection for CT. Its 1.15 MLE drives per-channel signal conditioning at multi-MHz sampling without external GPUs. Multi-gigabit transceivers stream raw transducer data from the analog front-end directly into the FPGA fabric. Medical imaging systems benefit from the device's deterministic latency and IEC 61508/ISO 14962 compliance potential at the integration level. Use it with an external DDR4 SO-DIMM for image buffer storage and a dedicated host CPU for clinical UI rendering.
Empfohlen
Radar Signal Processing (Phased Array / EW)
For phased-array radar and electronic-warfare (EW) systems, the 10AX115R3F40E2LG provides the logic and transceiver bandwidth needed to digitize multiple AESA element streams and run space-time adaptive processing (STAP) at line rate. Its 1.15 MLE and 1518 DSP blocks sustain 100+ MHz per-element FFT throughput across a 64-element array. GTx transceivers handle the long-haul fiber links from remote antenna head-ends. Designers also leverage the device's hard floating-point DSP for clutter-suppression algorithms that exceed fixed-point dynamic range in dense-target environments.
Empfohlen
Software Defined Radio Baseband
The 10AX115R3F40E2LG serves as the baseband processing engine in SDR base stations supporting CPRI 9.8G/4.9G and Open Fronthaul. Its GTx transceivers backhaul digitized RF from remote radio heads (RRH) into the FPGA fabric, where 1.15 MLE and 1518 DSP blocks implement LTE/NR PHY layer functions including FFT/iFFT, channel coding, and MIMO spatial processing. Its hard PCIe Gen3 x8 IP enables direct attach to a baseband host CPU or SoC. The 68.8 Mb embedded memory buffers sub-frame processing without DDR round-trips, reducing air-interface latency below 1 ms.
Empfohlen
Test & Measurement Digitizer Back-End
The 10AX115R3F40E2LG supports high-end test & measurement digitizers by aggregating ADC samples from multiple JESD204B/C links into the FPGA fabric at multi-GSPS rates. Its 1.15 MLE runs real-time FFT, channelization, and trigger-decision logic at full sample rate without resorting to external GPU pre-processing. The 1,518 DSP blocks implement windowing, peak detection, and digital down-conversion in real time. Engineers typically pair this FPGA with dual 4 GSPS ADCs to build 8 GHz instantaneous-bandwidth oscilloscopes and signal analyzers.
Empfohlen
ASIC Prototyping (Mid-to-Large Designs)
The 10AX115R3F40E2LG is widely used for ASIC prototyping because its 1.15 MLE density matches mid-to-large ASIC gate counts (after taking into account the FPGA-overhead factor of 4-7x). Designers map ASIC RTL into the Arria 10 fabric via Quartus Prime Pro with multi-FPGA partitioning over PCIe or dedicated GTx backplanes. The 342 user I/O pins expose a rich prototyping pin map for connecting multiple FPGAs in a mesh. This role is supported by Intel's Quartus Pro Design and Pro Edition ASIC prototyping flow plus soft logic tools.
Empfohlen
Broadcast Video Processing (4K/UHD)
The 10AX115R3F40E2LG supports broadcast video processing for 4K/UHD workflows including 12G-SDI ingest, color-space conversion, and HDR/WCG mapping. Its 1518 DSP blocks accelerate scaling and deinterlacing kernels, while its 68.8 Mb embedded memory acts as multi-frame line buffers. GTx transceivers receive uncompressed 12G-SDI streams directly from the SDI deserializer. The combination of high logic density and external DDR4 bandwidth is well-suited for broadcast switchers and IP gateway cards used in live production trucks.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115R3F40E2LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115R3F40E2SG | 10AX115R2F40E2LG | 10AX115R4F40E2LG | 10AX115R2F40I2LG | 10AX115R2F40I2SG | 10AX115R2F40E2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 1517-ball FC-FBGA (F40) | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | -3 (this product) | -3 (same) | -2 (slower) | -4 (fastest) | -2 (slower) | -2 (slower) | -2 (slower) |
| Temperature Grade | Extended (E2) | Commercial (S2) | Extended (E2) | Extended (E2) | Industrial (I2) | Industrial (I2) | Extended (E2) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| User I/O | 342 | 342 | 342 | 342 | 342 | 342 | 342 |
| Transceiver Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps |
Wichtigste Unterscheidungsmerkmale
- Speed grade -3 in the Arria 10 family for higher Fmax (vs. 10AX115R2F40E2LG)
- Extended temperature grade for outdoor and industrial deployments (vs. 10AX115R3F40E2SG)
- GTx transceiver tile integration eliminates external PHY (vs. 10AX115N3F40E2LG)
Designhinweise
The 1517-ball FC-FBGA package requires microvia stack-up (4-2-4 or 5-2-5 laser-drilled via-in-pad or staggered microvia construction). Standard 8/8-mil-pitch through-vias cannot escape a fine-pitch BGA - any other stack-up will create shorts or open circuits during reflow. Verified design reference: Intel Arria 10 GX FPGA Board Design Guidelines (AN-628-class app note family). Plan BGA escape on inner layers to maximize signal-integrity margins for GTx channels.
GTx transceiver channels running at 25 Gbps+ require length-matched differential pair routing with intra-pair skew under 1 ps and inter-pair skew budgeted against the FPGA's GTx receiver skew tolerance. Use a 100-ohm differential impedance (90 ohm optional) with 4-layer stack-up referenced to a solid ground plane. Crosstalk isolation between adjacent TX and RX pairs must be maintained via at least 3W spacing on the same layer. Refer to the Arria 10 GX Transceiver User Guide for full SI margins.
Estimated: At 100% transceiver utilization (all 28 Gbps channels active), the 10AX115R3F40E2LG dissipates approximately 25-35 W. With the FC-FBGA package theta_JA in the 8-12 C/W range (depending on PCB stack-up and airflow), junction temperature can exceed 100 C without a heatsink or forced-air cooling. Plan for a top-side heatsink with TIM2 thermal interface material and at least 200 LFM airflow for sustained 28 Gbps operation. Power-aware Quartus settings help reduce worst-case thermal load by 15-25%.
Do not assume all 1517 balls are user I/O - many are power, ground, and configuration. The F40 package pin count exceeds user I/O because of the dedicated power/ground and JTAG/MSEL/AS configuration balls. Read the F40 Pin Connection Guidelines PDF before PCB symbol capture. Do not forget the configuration mode pins (MSEL[3:0], nCONFIG, nSTATUS, CONF_DONE) - incorrect mode selection bricks the FPGA boot sequence. Always check the Intel Quartus Prime Pin Planner tool for ball bank assignments and voltage compatibility.
Compliance-Informationen
RoHS and lead-free per Intel product page. AEC-Q100 not applicable (FPGAs are not automotive-grade discrete semiconductors). Conflict-minerals compliance per Intel Conflict Minerals Report.
