10AX115R3F40E2SG vs 10AX090R2F40E2SG Vergleich
Detaillierter Direktvergleich von 10AX115R3F40E2SG von Intel und 10AX090R2F40E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115R3F40E2SG | 10AX090R2F40E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.925,00 | $4.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | — |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | Variable-precision, hardened floating-point capable |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | — |
| Speed Grade | -2 | 2 (R2 -2 transceiver rating) |
| Temperature Grade | E2 (0C to +100C) | E2 (Extended: -40C to +100C junction) |
| Gehäuse | 1517-ball FCBGA (F40), 1.0 mm pitch | — |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount (FCBGA ball grid) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| RoHS-Status | Compliant | — |
| Logic Elements | — | 900000 |
| LABs/CLBs | — | 339620 |
| Total RAM Bits | — | 59234304 |
| User I/O Count | — | 342 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Code | — | F40 (approx. 40mm FCBGA) |
| Lead-Free / RoHS | — | Yes (SG suffix) |
| Transceivers | — | Up to 14.1 Gbps (Arria 10 GX feature) |
| Process Node | — | TSMC 20nm |
| MSL-Level | — | 3 (168 Hours) |
| Packaging | — | Tray |