10AX115R3F40E2SG vs 10AX090R2F40E2SG Comparação
Comparação detalhada lado a lado de 10AX115R3F40E2SG por Intel e 10AX090R2F40E2SG por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | 10AX115R3F40E2SG | 10AX090R2F40E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $4.925,00 | $4.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | — |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | Variable-precision, hardened floating-point capable |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | — |
| Speed Grade | -2 | 2 (R2 -2 transceiver rating) |
| Temperature Grade | E2 (0C to +100C) | E2 (Extended: -40C to +100C junction) |
| Encapsulamento | 1517-ball FCBGA (F40), 1.0 mm pitch | — |
| Tipo de montagem | Surface Mount (Flip-Chip BGA) | Surface Mount (FCBGA ball grid) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Status RoHS | Compliant | — |
| Logic Elements | — | 900000 |
| LABs/CLBs | — | 339620 |
| Total RAM Bits | — | 59234304 |
| User I/O Count | — | 342 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Code | — | F40 (approx. 40mm FCBGA) |
| Lead-Free / RoHS | — | Yes (SG suffix) |
| Transceivers | — | Up to 14.1 Gbps (Arria 10 GX feature) |
| Process Node | — | TSMC 20nm |
| Nível MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |