10CL010YM164I7G vs 10CL010ZM164I8G Vergleich
Detaillierter Direktvergleich von 10CL010YM164I7G von Intel und 10CL010ZM164I8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10CL010YM164I7G | 10CL010ZM164I8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,45 | $23,10 |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 10,320 |
| Embedded Memory | 423,936 bits (414 Kb) | 423,936 bits (414 Kbits) |
| Embedded 18 x 18 Multipliers | 23 | — |
| Maximum User I/O Pins | 101 | — |
| General-Purpose PLLs | 2 | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | — |
| Betriebstemperaturbereich | -40 °C to 100 °C (Industrial) | — |
| Gehäuse | 164-ball MBGA (8 mm x 8 mm) | 164-ball MBGA (FineLine BGA, M164) |
| Montageart | Surface Mount (BGA) | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | PS, FPP, JTAG |
| I/O Signaling Standards | LVCMOS 1.2 V to 3.3 V, LVDS | — |
| Process Node | TSMC low-power process | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded 18x18 Multipliers | — | 46 |
| Maximum User I/O | — | 101 |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Process Technology | — | 60 nm low-power CMOS |
| Core Voltage | — | 1.0 V (typical), 1.2 V I/O banks |
| PLLs | — | 4 (per device, exact count [DATA_NEEDED: PLL count]) |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| External Memory Support | — | DDR2, DDR3, LPDDR2 (via soft IP) |
| Packaging | — | Tray (I8G suffix) |