10CL010YM164I7G vs 10CL010ZM164I8G 对比
详细并排对比 10CL010YM164I7G 出自 Intel 和 10CL010ZM164I8G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10CL010YM164I7G | 10CL010ZM164I8G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $9.45 | $23.10 |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 10,320 |
| Embedded Memory | 423,936 bits (414 Kb) | 423,936 bits (414 Kbits) |
| Embedded 18 x 18 Multipliers | 23 | — |
| Maximum User I/O Pins | 101 | — |
| General-Purpose PLLs | 2 | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | — |
| 工作温度范围 | -40 °C to 100 °C (Industrial) | — |
| 封装 | 164-ball MBGA (8 mm x 8 mm) | 164-ball MBGA (FineLine BGA, M164) |
| 安装类型 | Surface Mount (BGA) | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | PS, FPP, JTAG |
| I/O Signaling Standards | LVCMOS 1.2 V to 3.3 V, LVDS | — |
| Process Node | TSMC low-power process | — |
| RoHS 状态 | Compliant | Compliant |
| MSL 等级 | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded 18x18 Multipliers | — | 46 |
| Maximum User I/O | — | 101 |
| 工作温度 | — | -40C to +100C (Industrial) |
| Process Technology | — | 60 nm low-power CMOS |
| Core Voltage | — | 1.0 V (typical), 1.2 V I/O banks |
| PLLs | — | 4 (per device, exact count [DATA_NEEDED: PLL count]) |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| External Memory Support | — | DDR2, DDR3, LPDDR2 (via soft IP) |
| Packaging | — | Tray (I8G suffix) |