10M02DCU324A7G vs 10M02DCV36C8G Vergleich
Detaillierter Direktvergleich von 10M02DCU324A7G von Intel und 10M02DCV36C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M02DCU324A7G | 10M02DCV36C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,30 | $5,10 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 2,000 | 2,000 |
| Embedded Memory | 110,592 bits | — |
| User I/O Count | 160 | 27 |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | — |
| Core Voltage | 1.15 V to 1.25 V | — |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Betriebs-Sperrschichttemperatur | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Total RAM Bits | — | 110,592 bits (~108 Kbits) |
| Configuration Memory | — | Internal flash (non-volatile, on-die) |
| Gehäuse | — | 36-UFBGA WLCSP |
| Speed Grade | — | C8 |
| Temperature Grade | — | Industrial (G suffix) |
| Betriebstemperatur | — | -40C to +100C |
| Versorgungsspannung | — | [DATA_NEEDED: core/IO voltage] |
| PLL Count | — | [DATA_NEEDED: PLL count for 10M02] |
| DSP Blocks | — | [DATA_NEEDED: DSP/multiplier block count] |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |