10M02DCV36C7G vs 10M02DCU324I7G Vergleich
Detaillierter Direktvergleich von 10M02DCV36C7G von Intel und 10M02DCU324I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M02DCV36C7G | 10M02DCU324I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,34 | $1,55 |
| Device Type | Non-volatile field-programmable gate array | — |
| Series | MAX 10 | — |
| Logic Elements | 2,000 | — |
| I/O Pins | 27 | — |
| Embedded Memory | 110,592 bits | — |
| Operating Voltage | 1.2 V | — |
| Process Technology | 55 nm | — |
| Gehäuse | 36-WFBGA, WLCSP | 324-ball UBGA (U324) |
| Montageart | Surface Mount | — |
| FPGA Configuration | Non-volatile | — |
| Logic Architecture | Field-programmable gate array | — |
| Product Category | Embedded FPGA | — |
| Package Pin Count | 36 balls | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Family | — | MAX 10 |
| Logic Elements (LEs) | — | 2,000 |
| Embedded Memory (M9K blocks) | — | 16 |
| Embedded Memory (bits) | — | 110,592 |
| Embedded Multipliers (18x18) | — | 16 |
| User I/O Count | — | 160 |
| User I/O Banks | — | 8 |
| Pin/Pitch | — | 324 balls / 0.8 mm pitch |
| Process Node | — | 55 nm |
| Configuration Memory | — | On-chip dual-boot flash |
| Core Voltage (VCCINT) | — | 1.2 V |
| Analog Block | — | 12-bit SAR ADC with temperature sensor |
| Operating Temperature (Industrial) | — | -40C to +100C (I7 grade) |