10M02DCV36C7G vs 10M02DCU324I7G Comparación
Comparación detallada lado a lado de 10M02DCV36C7G por Intel y 10M02DCU324I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M02DCV36C7G | 10M02DCU324I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,34 | $1,55 |
| Device Type | Non-volatile field-programmable gate array | — |
| Series | MAX 10 | — |
| Logic Elements | 2,000 | — |
| I/O Pins | 27 | — |
| Embedded Memory | 110,592 bits | — |
| Operating Voltage | 1.2 V | — |
| Process Technology | 55 nm | — |
| Encapsulado | 36-WFBGA, WLCSP | 324-ball UBGA (U324) |
| Tipo de montaje | Surface Mount | — |
| FPGA Configuration | Non-volatile | — |
| Logic Architecture | Field-programmable gate array | — |
| Product Category | Embedded FPGA | — |
| Package Pin Count | 36 balls | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Family | — | MAX 10 |
| Logic Elements (LEs) | — | 2,000 |
| Embedded Memory (M9K blocks) | — | 16 |
| Embedded Memory (bits) | — | 110,592 |
| Embedded Multipliers (18x18) | — | 16 |
| User I/O Count | — | 160 |
| User I/O Banks | — | 8 |
| Pin/Pitch | — | 324 balls / 0.8 mm pitch |
| Process Node | — | 55 nm |
| Configuration Memory | — | On-chip dual-boot flash |
| Core Voltage (VCCINT) | — | 1.2 V |
| Analog Block | — | 12-bit SAR ADC with temperature sensor |
| Operating Temperature (Industrial) | — | -40C to +100C (I7 grade) |