10M08DAF484I7P vs 10M08DCF484C8G Vergleich
Detaillierter Direktvergleich von 10M08DAF484I7P von Intel und 10M08DCF484C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DAF484I7P | 10M08DCF484C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,10 | $19,80 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory | 378 Kbits (46,080 M9K bits) | — |
| User I/O Count | 250 | 250 |
| Gehäuse | 484-ball FBGA (F484) | 484-ball FBGA (FineLine BGA) |
| Pitch | 1.0 mm | — |
| Core Voltage | 1.0 V | 1.2 V (on-chip regulator) |
| Speed Grade | -7 | C8 (commercial, standard speed) |
| Betriebstemperatur | -40 C to +100 C (Industrial) | Commercial (0C to +85C junction, per speed grade) |
| On-chip Configuration Flash | Yes, dual-boot | — |
| Embedded ADC | 12-bit, 1 Msps, 16 channels | — |
| DSP Blocks | Yes (24 x 18-bit multipliers) | — |
| PLLs | 4 | 2 |
| Maximum LVDS Channels | [DATA_NEEDED: per-bank LVDS channel count] | — |
| User Flash | 8 Kbits (non-volatile) | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| Logic Elements | — | 8,000 |
| Embedded Memory (M9K) | — | 378 Kbits (49 M9K blocks) |
| Embedded Multiplier Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Process Technology | — | 55 nm TSMC embedded NOR flash |
| Configuration Memory | — | Dual on-chip flash (instant-on, dual-boot) |
| Global Clock Networks | — | Up to 16 |
| Integrated ADC | — | 12-bit SAR, up to 1 Msps |
| LVDS Support | — | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) |