10M08DAF484I7P vs 10M08DCF484C8G Сравнение
Подробное сравнение бок о бок 10M08DAF484I7P от Intel и 10M08DCF484C8G от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | 10M08DAF484I7P | 10M08DCF484C8G |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $22,10 | $19,80 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory | 378 Kbits (46,080 M9K bits) | — |
| User I/O Count | 250 | 250 |
| Корпус | 484-ball FBGA (F484) | 484-ball FBGA (FineLine BGA) |
| Pitch | 1.0 mm | — |
| Core Voltage | 1.0 V | 1.2 V (on-chip regulator) |
| Speed Grade | -7 | C8 (commercial, standard speed) |
| Рабочая температура | -40 C to +100 C (Industrial) | Commercial (0C to +85C junction, per speed grade) |
| On-chip Configuration Flash | Yes, dual-boot | — |
| Embedded ADC | 12-bit, 1 Msps, 16 channels | — |
| DSP Blocks | Yes (24 x 18-bit multipliers) | — |
| PLLs | 4 | 2 |
| Maximum LVDS Channels | [DATA_NEEDED: per-bank LVDS channel count] | — |
| User Flash | 8 Kbits (non-volatile) | — |
| Статус RoHS | Compliant | Compliant |
| Тип монтажа | Surface Mount (BGA) | Surface Mount (BGA) |
| Уровень MSL | [DATA_NEEDED: moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| Logic Elements | — | 8,000 |
| Embedded Memory (M9K) | — | 378 Kbits (49 M9K blocks) |
| Embedded Multiplier Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Process Technology | — | 55 nm TSMC embedded NOR flash |
| Configuration Memory | — | Dual on-chip flash (instant-on, dual-boot) |
| Global Clock Networks | — | Up to 16 |
| Integrated ADC | — | 12-bit SAR, up to 1 Msps |
| LVDS Support | — | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) |