10M08DCU324A7G vs 10M04DCU324A7G Vergleich
Detaillierter Direktvergleich von 10M08DCU324A7G von Intel und 10M04DCU324A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DCU324A7G | 10M04DCU324A7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,10 | $9,85 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | 4,000 |
| Embedded Memory (Kbits) | 246 | — |
| User Flash Memory (bits) | 387,072 | — |
| Total User I/O | 246 | — |
| Gehäuse | 324-LFBGA (U324) | 324-pin UFBGA (U324) |
| Process Technology | 55 nm | — |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Maximum Internal Clock Frequency | 382 MHz | — |
| Betriebstemperatur | -40 C to +125 C | [DATA_NEEDED: temperature grade -40C to +100C vs -40C to +125C] |
| AEC-Q100 Grade | Automotive qualified | — |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash (instant-on, no external PROM) |
| JEDEC Package Code | S-PBGA-B324 | — |
| Terminal Position | Bottom | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | — |
| Process Node | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Embedded Memory (bits) | — | 193,536 |
| User Flash Memory | — | Integrated (non-volatile configuration) |
| Maximum User I/O | — | 246 |
| Ball Pitch | — | 0.8 mm |
| Speed Grade | — | 7 |
| AEC-Q100 Qualification | — | Yes (A-grade suffix) |
| Lead-Free / RoHS | — | Yes (G suffix) |
| Integrated ADC | — | Yes (12-bit SAR, multiple channels) |
| PLL Count | — | [DATA_NEEDED: PLL count for 10M04] |
| Multipliers (18x18) | — | [DATA_NEEDED: multiplier count for 10M04] |