10M08DCU324A7G vs 10M04DCU324A7G Comparación
Comparación detallada lado a lado de 10M08DCU324A7G por Intel y 10M04DCU324A7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08DCU324A7G | 10M04DCU324A7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,10 | $9,85 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | 4,000 |
| Embedded Memory (Kbits) | 246 | — |
| User Flash Memory (bits) | 387,072 | — |
| Total User I/O | 246 | — |
| Encapsulado | 324-LFBGA (U324) | 324-pin UFBGA (U324) |
| Process Technology | 55 nm | — |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Maximum Internal Clock Frequency | 382 MHz | — |
| Temperatura de funcionamiento | -40 C to +125 C | [DATA_NEEDED: temperature grade -40C to +100C vs -40C to +125C] |
| AEC-Q100 Grade | Automotive qualified | — |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash (instant-on, no external PROM) |
| JEDEC Package Code | S-PBGA-B324 | — |
| Terminal Position | Bottom | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | — |
| Process Node | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Embedded Memory (bits) | — | 193,536 |
| User Flash Memory | — | Integrated (non-volatile configuration) |
| Maximum User I/O | — | 246 |
| Ball Pitch | — | 0.8 mm |
| Speed Grade | — | 7 |
| AEC-Q100 Qualification | — | Yes (A-grade suffix) |
| Lead-Free / RoHS | — | Yes (G suffix) |
| Integrated ADC | — | Yes (12-bit SAR, multiple channels) |
| PLL Count | — | [DATA_NEEDED: PLL count for 10M04] |
| Multipliers (18x18) | — | [DATA_NEEDED: multiplier count for 10M04] |