10M08SCU169I7G - MAX 10 FPGA 8K LE 169-UBGA | Intel
Teilenummer: 10M08SCU169I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $17.1 | $17,10 |
| 10 | $15.4 | $154,00 |
| 100 | $12.95 | $1.295,00 |
| 500 | $11.2 | $5.600,00 |
| 1.000 | $9.85 | $9.850,00 |
10M08SCU169I7G Übersicht
What is a non-volatile FPGA? A non-volatile FPGA is a field-programmable gate array that integrates on-chip flash configuration memory, allowing the device to power up instantly into a known working state without an external boot PROM. FPGAs belong to the broader programmable logic family, sitting between fixed-function ASICs and software-driven microcontrollers in terms of flexibility and performance. The MAX 10 family is positioned at the entry level of Intel's (formerly Altera's) FPGA portfolio, bridging the gap between small CPLDs and larger Cyclone-series FPGAs.
Key features include 8,000 logic elements, 378 Kbits of embedded SRAM, 4 analog-to-digital converter (ADC) channels at 1 MSPS, 1.2 V core voltage, dual configuration flash, and integrated phase-locked loops (PLLs). The device supports LVDS, LVCMOS, SSTL, and other common I/O standards, and includes hardware multipliers (DSP blocks) and user flash memory configurable as emulation storage or firmware storage.
The 10M08SCU169I7G uses Intel's Quartus Prime design software for synthesis, place-and-route, and timing closure. It supports the Nios II soft-core processor, enabling single-chip microcontroller + glue-logic implementations. The integrated ADC, temperature-sensing diodes, and dual-boot flash make it suitable for motor control and industrial sensing front-ends.
Typical applications include industrial I/O expansion modules, motor control and drives, video bridging and display controllers, portable medical device front-ends, and low-cost ASIC prototyping. The U169 package footprint is shared with multiple MAX 10 OPNs, enabling PCB reuse across density options.
When designing with this part, allocate I/O banks carefully: the U169 package exposes 130 user I/Os across 8 banks, each with its own VCCIO rail. Decouple each VCCIO and VCCINT plane with 100 nF + 10 uF capacitors placed within 3 mm of the balls, and follow Intel's recommended PCB stack-up for fine-pitch BGA breakout. For high-speed LVDS, length-match the differential pairs within the bank.
This page synthesizes distributor pricing, same-package drop-in alternatives from the Site MPN list, application circuits, and design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für 10M08SCU169I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M08SCU169I7G (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Configuration Memory, Speed Grade, Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M08SCU169A7G
✅ Drop-In✓ Auf Lager
$19.85 / Stück
Datenblatt ansehen →10M08SAU169I7G
✅ Drop-In✓ Auf Lager
$10.45 / Stück
Datenblatt ansehen →10M08SAU169C8G
✅ Drop-In✓ Auf Lager
$10.2 / Stück
Datenblatt ansehen →10M08SAU169A7G
✅ Drop-In✓ Auf Lager
$10.5 / Stück
Datenblatt ansehen →10M08SAU324I7G
✅ Drop-In✓ Auf Lager
$23.4 / Stück
Datenblatt ansehen →10M04SCU169I7G
✅ Drop-In✓ Auf Lager
$9.95 / Stück
Datenblatt ansehen →10M08SCU169I7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded User Flash | 387,072 bits (48 KB) |
| User I/O Count | 130 |
| Maximum User I/O (package) | 130 (U169) |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | TSMC 55 nm embedded flash |
| Configuration Memory | Internal flash (non-volatile, dual-boot) |
| Gehäuse | 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch |
| Betriebstemperatur | -40 C to +100 C (industrial, suffix I7G) |
| ADC | 12-bit, 1 MSPS, 4 channels (single supply variant) |
| Montageart | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes / Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| Configuration Method | JTAG, internal flash, dual-boot |
| Supported I/O Standards | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI |
10M08SCU169I7G 169-ball ufbga / ubga (u169), 11 mm x 11 mm, 0.65 mm pitch Pinbelegungsleitfaden
Pinbelegung für 10M08SCU169I7G (169-ball ufbga / ubga (u169), 11 mm x 11 mm, 0.65 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M08SCU169I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M08SCU169I7G ist geeignet für 6 Anwendungs: Industrial I/O Expansion Module, Motor Control and Drive Front-End, Video Bridging and Display Controller, Portable Medical Device Front-End, Low-Cost ASIC Prototyping and Emulation, Glue Logic and Protocol Converter.
Industrial I/O Expansion Module
The 10M08SCU169I7G fits industrial I/O expansion modules because its 130 user I/Os across 8 banks can map directly to opto-isolated digital inputs, relay drivers, and encoder interfaces, eliminating a discrete ASIC plus glue CPLD. The 8,000 logic elements are sufficient for protocol conversion (Modbus RTU to Ethernet/IP) and the 387,072-bit user flash can store configuration data and calibration tables. Industrial -40C to +100C operation handles factory-floor temperatures. Compared with a discrete CPLD plus microcontroller architecture, the MAX 10 replaces two devices with one and reduces board area by roughly 30-40%.
Empfohlen
Motor Control and Drive Front-End
The 10M08SCU169I7G suits motor control and drive front-ends because the integrated 12-bit 1 MSPS 4-channel ADC simultaneously samples phase currents, DC bus voltage, and a temperature sensor without an external ADC chip. The 8,000 logic elements accommodate space-vector PWM generators, FOC datapaths, and protection logic. The 387 Kbit user flash stores motor parameters and lookup tables for sensorless startup. With industrial temperature grade and 55 nm embedded flash reliability, the device tolerates under-hood and inverter-cabinet environments where conventional SRAM-based FPGAs would be marginal.
Empfohlen
Video Bridging and Display Controller
The 10M08SCU169I7G bridges legacy video interfaces (CMOS camera, RGB, LVDS) to modern MIPI or HDMI outputs using the 130 user I/Os and internal M9K memory blocks for line buffers. At common video resolutions up to 720p60, 8,000 logic elements are sufficient for color-space conversion, scaling, and overlay composition. The non-volatile instant-on configuration is valuable for kiosk and signage applications where the system must display a splash screen within 50 ms of power-up, eliminating external boot PROM cost. Industrial temperature grade supports outdoor digital-signage enclosures.
Empfohlen
Portable Medical Device Front-End
The 10M08SCU169I7G is appropriate for portable medical device front-ends (pulse oximeter, glucose meter, ECG patch) because the integrated ADC samples bioelectric or optical signals directly while the user flash stores calibration coefficients, patient logs, and firmware updates. Non-volatile instant-on minimizes boot latency for emergency clinician workflows, and 8,000 LE supports DSP-style FIR filtering for noise rejection. The 1.2 V core and power-management features suit battery operation, while the 169-ball BGA measures only 11 mm x 11 mm, fitting compact handheld enclosures.
Empfohlen
Low-Cost ASIC Prototyping and Emulation
Engineers use the 10M08SCU169I7G for low-cost ASIC prototyping and IP validation because the 387,072-bit embedded user flash acts as on-chip emulation ROM, and the dual-boot feature enables field-upgradable RTL test images. The 8,000 logic elements map small SoC peripherals (UART, SPI, I2C controllers, custom DMA engines) before tape-out. Quartus Prime synthesis flow supports incremental compilation and Hardware-in-the-Loop (HIL) testbenches. Compared with renting a larger FPGA prototyping platform, a U169 board reduces per-engineer cost by approximately 70-80% for sub-10K gate designs.
Empfohlen
Glue Logic and Protocol Converter
The 10M08SCU169I7G is widely deployed as a glue-logic and protocol converter between microcontrollers, sensors, and backplane buses. The 130 user I/Os and 8 I/O banks support mixed-voltage interfaces (3.3 V, 2.5 V, 1.8 V, 1.5 V) without external level shifters, while 8,000 LE handles UART, SPI, I2C, and custom timing-sensitive glue. Non-volatile boot eliminates external boot ROMs, and the device's instant-on behavior suits power-rail-sequenced systems where downstream devices require deterministic initialization order.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M08SCU169I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M08SCU169A7G | 10M08SAU169I7G | 10M08SAU169C8G | 10M04SCU169I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 |
| User I/O | 130 | 130 | 130 | 130 | 130 |
| Embedded User Flash | 387,072 bits | 387,072 bits | 387,072 bits | 387,072 bits | Approximately 387,072 bits (MAX 10 04 family) |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C |
| Speed Grade | 7 (fastest) | 7 | 7 | 8 | 7 |
| Internal Configuration Memory | Yes (flash, dual-boot) | Yes (flash, dual-boot) | Yes (flash, dual-boot) | Yes (flash, dual-boot) | Yes (flash, dual-boot) |
| ADC (12-bit 1 MSPS) | 4 channels | 4 channels | 4 channels | 4 channels | 4 channels |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade in U169 package (vs. 10M08SCU169A7G)
- Drop-in pin compatibility within U169 footprint (vs. 10M08SAU169I7G)
- Highest speed grade 7 in U169 footprint (vs. 10M08SAU169C8G)
- Highest density in U169 family (vs. 10M04SCU169I7G)
Designhinweise
The U169 package is an 11 mm x 11 mm fine-pitch BGA with 0.65 mm ball pitch. Use 0.4 mm laser-drilled microvias in the fan-out pattern with a 4-layer 1 oz copper stack-up (signal-GND-power-signal). Escape the inner balls with dog-bone fan-out, and place the inner-row decoupling capacitors on the bottom side. Follow Intel MAX 10 hardware design guidelines for via-in-pad and solder-mask-defined pad geometry to avoid tombstoning during reflow.
MAX 10 FPGAs require separate VCCINT (1.2 V), VCCIOx (per-bank, 1.2 V to 3.3 V), VCCA (2.5 V analog for ADC), VCCD_PLL (1.2 V for PLLs), and a 3.3 V or 2.5 V VCCPD configuration bank. Decouple each rail with 100 nF X7R capacitors within 3 mm of the relevant balls, and add a 10 uF bulk capacitor per rail. Power-on sequencing requires VCCINT to ramp before or simultaneously with VCCIO; violation can latch-up the I/O buffers. The integrated ADC adds 2.5 V VCCA noise sensitivity - keep this rail isolated from switching DC-DC nodes by at least 20 dB attenuation.
For LVDS pairs above 200 Mbps, length-match the differential traces within 150 microns of each other and within the same I/O bank. Maintain 100 ohm differential impedance with 85 ohm trace-to-plane spacing. Use Intel's Pin Planner to assign LVDS pairs to true differential pins (positive and negative on adjacent balls); mismatched assignment works electrically but reduces Fmax by approximately 20-30%. For SDRAM or DDR interfaces, enable the Quartus Prime dynamic phase-shift feature on the PLL to deskew the strobe at high temperature.
Common pitfalls when bringing up MAX 10 designs include: (1) leaving JTAG TCK floating (always tie to ground through 1-10 kohm for board-level robustness), (2) selecting dual-boot without populating the second image selector jumper, which can leave the device in an unconfigured state after a failed update, (3) configuring unused GPIO as analog input and leaving them floating, which draws extra bias current, and (4) forgetting to enable the internal pull-up on nCONFIG or nSTATUS lines during board-level testing - external 10 kohm pull-ups are recommended even when the internal weak pull-up is enabled.
Compliance-Informationen
RoHS and REACH compliance per Intel MAX 10 material declaration. Not AEC-Q100 qualified - the MAX 10 family is not automotive-grade; automotive applications should consider Cyclone IV or Cyclone V automotive variants instead. Halogen-free per JEDEC JS709B.
