10M16SAU324I7G - MAX 10 FPGA, 16K LE, 246 I/O, 324-UBGA | Intel
Teilenummer: 10M16SAU324I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $47.5 | $47,50 |
| 10 | $43.2 | $432,00 |
| 100 | $38.75 | $3.875,00 |
| 250 | $35.1 | $8.775,00 |
| 500 | $32.4 | $16.200,00 |
10M16SAU324I7G Übersicht
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and DSP resources that can be reconfigured after manufacture to implement custom digital logic, glue logic, or even soft processor cores. MAX 10 FPGAs sit in the low-power, non-volatile segment of the FPGA hierarchy, positioned between simple CPLDs (in complexity) and higher-density SRAM-based FPGAs (in capability), and they belong to Intel's broader programmable logic device (PLD) family, which also includes Cyclone, Arria, and Stratix families.
Key features of the 10M16SAU324I7G include 16K logic elements (LEs), 378 Kbits of embedded SRAM (M9K blocks), up to 45 embedded 18x18 multipliers, a hard DDR3 memory controller, integrated ADC (12-bit SAR, up to 17 channels), and a hard Nios II soft-core processor support path. The 324-pin UFBGA package exposes 246 single-ended user I/Os (or up to 123 LVDS pairs), and the device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability.
The MAX 10 architecture pairs a non-volatile flash configuration cell with an SRAM-based logic fabric, giving instant-on behavior at power-up while still allowing unlimited reconfiguration through JTAG. The integrated 12-bit ADC samples up to 17 analog channels at 1 MSPS, the on-die flash supports dual boot images for failsafe field updates, and the hard memory controller simplifies DDR3/LPDDR2 interface design without consuming FPGA fabric.
Typical applications include industrial motor control and HMI, factory automation I/O expansion, portable medical instrumentation, low-cost video bridging (MIPI-CSI to parallel RGB), automotive body-electronics rear-view camera preprocessing, and consumer display controllers. The wide operating temperature range (industrial -40C to +100C) and on-die analog simplify designs that need a single-chip controller with mixed-signal support.
When designing with this device, respect the 1.2 V core supply ramp sequence and place the configuration flash and JTAG pull-ups per AN 495. For high-speed DDR3 interfaces, follow Intel's pinout guidelines for the U324 package, including length-matched byte groups and 100-ohm differential terminations. The on-die ADC shares analog pins with the user I/O bank - keep analog routing short and isolated from digital switching nets to avoid coupling noise.
Drop-in-Alternativen für 10M16SAU324I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M16SAU324I7G (gleiche Bauform und Footprint) – abweichend in Package, Configuration Memory, Process Technology, Mounting Type, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M16DAU324I7G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M16DAU324C8G
✅ Drop-In✓ Auf Lager
$35.4 / Stück
Datenblatt ansehen →10M25SAU324I7G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M08SAU324I7G
✅ Drop-In✓ Auf Lager
$23.4 / Stück
Datenblatt ansehen →10M16DCU324I7G
✅ Drop-In✓ Auf Lager
$40.1 / Stück
Datenblatt ansehen →10M16SAU324I7G Grenzwerte & elektrische Eigenschaften
| Series | MAX 10 |
| Logic Elements | 16000 |
| Embedded Memory | 378 Kbits (M9K) |
| User Flash Memory | 562176 bits |
| Maximum User I/O | 246 |
| Embedded Multipliers (18x18) | 45 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Gehäuse | 324-pin UFBGA (U324) |
| Montageart | Surface Mount |
| Core Voltage | 1.2 V |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Speed Grade | 7 |
| On-die ADC | 12-bit SAR, up to 17 channels, 1 MSPS |
| Configuration | Internal flash, dual-boot, JTAG |
| RoHS-Status | Compliant |
10M16SAU324I7G 324-pin ufbga (u324) Pinbelegungsleitfaden
Pinbelegung für 10M16SAU324I7G (324-pin ufbga (u324)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M16SAU324I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M16SAU324I7G ist geeignet für 7 Anwendungs: Industrial Motor Control and Drive, Factory Automation I/O Expansion Module, Portable Medical Instrumentation, Low-Cost Video Bridge (MIPI-CSI to RGB), Automotive Rear-View Camera Preprocessing, Consumer Display Controller and LED Wall Driver, IoT Edge Sensor Aggregation Gateway.
Industrial Motor Control and Drive
The 10M16SAU324I7G fits industrial motor control and variable-frequency drive applications because its 16K logic elements and 45 embedded 18x18 multipliers can implement field-oriented control (FOC) algorithms and space-vector PWM in a single device. The integrated 12-bit SAR ADC samples motor phase currents and DC-bus voltage directly, eliminating external analog front-end ICs, while the 246 user I/Os in the U324 package handle multi-axis encoder inputs (QEP), Hall sensors, and gate-driver PWM outputs. Designers place the 10M16SAU324I7G on the control board with a 1.2 V core LDO and follow Intel's MAX 10 hardware design guide for ADC analog routing. Trade-off: the MAX 10 family is not AEC-Q100 qualified, so it is ideal for factory-floor drives but not under-hood automotive traction inverters.
Empfohlen
Factory Automation I/O Expansion Module
For factory-automation remote I/O and EtherCAT slave modules, the 10M16SAU324I7G provides sufficient logic capacity to implement an EtherCAT slave controller, digital I/O mapping, and diagnostic logic in fabric while the 324-UBGA package exposes enough pins to support 32 digital inputs, 16 digital outputs, and dual Ethernet PHYs. The non-volatile configuration means the module boots into operation within milliseconds, critical for hot-swappable industrial backplane systems. The integrated ADC samples 4-20 mA analog inputs directly, reducing BOM. Compared to a microcontroller + CPLD solution, the MAX 10 collapses two ICs into one, simplifying PCB layout and lowering BOM cost.
Empfohlen
Portable Medical Instrumentation
The 10M16SAU324I7G serves portable medical devices such as patient monitors, infusion pumps, and handheld ultrasound probe interfaces, where its 16K LE fabric implements DSP filter chains and UI graphics while the on-die 12-bit ADC captures bio-signal channels (ECG, SpO2, temperature). The non-volatile MAX 10 architecture supports instant-on boot critical for emergency-care devices, and the industrial -40C to +100C temperature range handles clinical and field environments. Designers benefit from the single-chip integration that reduces board area for handheld form factors. Note that medical designs still require IEC 60601-1 system-level compliance certification, which the 10M16SAU324I7G itself does not carry.
Empfohlen
Low-Cost Video Bridge (MIPI-CSI to RGB)
In cost-sensitive video bridging applications such as converting a MIPI-CSI-2 image sensor output to a parallel RGB LCD interface, the 10M16SAU324I7G's 246 I/Os and 16K LE fabric provide the routing and FIFO resources needed for the protocol conversion at 720p/30fps. The integrated DDR3 memory controller interfaces directly to a 16-bit DDR3L DRAM for line buffering without consuming user logic. Designers place the FPGA between the camera module and the LCD, with a 1.2 V core regulator and 100 MHz reference clock. Trade-off: for >1080p/60fps bridging, a larger Cyclone V or Cyclone 10 LP device is required.
Empfohlen
Automotive Rear-View Camera Preprocessing
Although not AEC-Q100 qualified itself, the 10M16SAU324I7G is widely used in automotive body-electronics rear-view camera preprocessing modules that sit behind an automotive-qualified serializer/deserializer. The 16K LE fabric handles image scaling, overlay rendering (distance guidelines), and LVDS-to-CML conversion, while the 246 I/Os in the U324 package expose all necessary parallel video bus and control signals. Operating temperature is adequate for cabin-mounted electronics. For under-hood or AEC-Q100-mandated applications, designers should instead use Cyclone V or SmartFusion2 with proper automotive qualification.
Empfohlen
Consumer Display Controller and LED Wall Driver
For consumer digital signage, LED wall drivers, and multi-display KVM switches, the 10M16SAU324I7G provides sufficient logic to implement HDMI/DVI passthrough, EDID emulation, and per-panel brightness/color correction, while the U324 package exposes enough I/O to drive up to four parallel RGB/LVDS display outputs. The integrated ADC can monitor panel backlight current for closed-loop dimming. The 16K LE is enough for 4-channel 1080p pixel-clock processing. Trade-off vs a dedicated display controller IC: the MAX 10 offers flexible customization but requires firmware development using Intel Quartus Prime instead of a fixed-function ASIC.
Empfohlen
IoT Edge Sensor Aggregation Gateway
In IoT edge gateways aggregating multiple sensor buses (I2C, SPI, UART, 1-Wire, Modbus) into a single Ethernet or Wi-Fi uplink, the 10M16SAU324I7G acts as the protocol-conversion brain with its 246 I/Os and 16K LE fabric. The non-volatile MAX 10 boot ensures the gateway starts running within milliseconds of power-up, while the integrated ADC samples analog sensor channels (temperature, humidity, light). Designers pair it with a Wi-Fi or Ethernet module and a small embedded Linux host. The trade-off: for battery-powered IoT nodes, the MAX 10 static power (~100 mW) is too high and a MAX IIZ CPLD or microcontroller is preferable.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M16SAU324I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M16DAU324I7G | 10M16DAU324C8G | 10M25SAU324I7G | 10M08SAU324I7G | 10M16DCU324I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-pin UFBGA (U324) | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 25,000 | 8,000 | 16,000 |
| Embedded Multipliers (18x18) | 45 | 45 | 45 | 55 | 24 | 45 |
| Embedded Memory | 378 Kbits | 378 Kbits | 378 Kbits | 594 Kbits | 189 Kbits | 378 Kbits |
| User Flash Memory | 562 Kbits | 562 Kbits | 562 Kbits | 675 Kbits | 295 Kbits | 562 Kbits |
| Maximum User I/O | 246 | 246 | 246 | 246 | 246 | 246 |
| Configuration Image | Single (S) | Dual (D) | Dual (D) | Single (S) | Single (S) | Dual (D) |
| Speed Grade | 7 (industrial) | 7 (industrial) | 8 (commercial) | 7 (industrial) | 7 (industrial) | 7 (industrial) |
| On-die ADC | 12-bit, 17 ch, 1 MSPS | 12-bit, 17 ch, 1 MSPS | 12-bit, 17 ch, 1 MSPS | 12-bit, 17 ch, 1 MSPS | 12-bit, 17 ch, 1 MSPS | 12-bit, 17 ch, 1 MSPS |
| Operating Temperature | -40C to +100C | -40C to +100C | 0C to +85C | -40C to +100C | -40C to +100C | -40C to +100C |
Wichtigste Unterscheidungsmerkmale
- Highest I/O count in the 10M16 density tier (vs. 10M16SAU169I7G)
- Single-image flash for simple single-firmware designs (vs. 10M16DAU324I7G)
- Industrial speed grade 7 vs commercial speed grade 8 (vs. 10M16DAU324C8G)
Designhinweise
The 10M16SAU324I7G core operates from a 1.2 V supply with separate VCCA (2.5 V or 3.3 V analog) and VCCIO (1.2 V to 3.3 V) rails for I/O banks. Intel recommends a 4-layer PCB with a dedicated power plane for VCCINT and decoupling per the MAX 10 PowerPlay Early Power Estimator. Bulk 100 uF tantalum plus per-pin 0.1 uF and 10 uF ceramic decoupling are required. Estimated: at 25% toggle rate and 25% utilization, total consumption is approximately 350 mW on VCCINT plus 100 mW on VCCIO.
The U324 UFBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15 C/W with adequate PCB copper, rising to 28 C/W on a standard 4-layer board. Estimated: at 1 W total dissipation, junction temperature rise is 15 C above ambient - well within the 100 C industrial limit. For sealed enclosures without airflow, derate to 0.7 W or add a thermal via array under the center BGA balls.
The 324-ball UFBGA uses 0.8 mm pitch with a 17x17 array (some balls are non-populated). Per Intel MAX 10 hardware design guide AN 495, route all signals on inner layers with microvia-in-pad for the BGA escape. The JTAG, MSEL[3:0], and configuration-mode pins require 4.7 kohm pull-ups to VCCIO. Differential pairs (LVDS) must be length-matched within 20 mils (500 um) and 100-ohm differential impedance-controlled.
Do not apply power to VCCINT before VCCA and VCCIO - Intel requires a maximum 100 ms power-rail skew with VCCA ramping first. Configuring the device in a non-supported mode (wrong MSEL[3:0] setting) latches the FPGA into an undefined state and requires power cycling to recover. The on-die ADC analog inputs are NOT 5 V tolerant; exceeding 3.3 V on an analog input pin permanently damages the ADC block. Use an external resistor divider or op-amp buffer for higher-voltage signals.
Compliance-Informationen
RoHS and REACH compliant per Intel product page. The 10M16SAU324I7G is NOT AEC-Q100 qualified; for automotive under-hood applications use AEC-Q100-qualified Cyclone V or later families. MSL3 per JEDEC J-STD-020.
