10M16DCU324I7G vs 10M08DCU324I7G Vergleich
Detaillierter Direktvergleich von 10M16DCU324I7G von Intel und 10M08DCU324I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M16DCU324I7G | 10M08DCU324I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $40,10 | $8,50 |
| Family | MAX 10 | — |
| Logic Elements | 16,000 | — |
| Adaptive Logic Modules (ALMs) | 9,920 | — |
| User I/O Count (Maximum) | 246 | — |
| Embedded Memory (M9K Blocks) | 558 Kbits | — |
| Distributed Logic RAM | 12.5 Kbits | — |
| Embedded User Flash | 562,176 bits (70 KB) | — |
| Embedded 18x18 Multipliers | 45 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Maximum LVDS Channels | 125 | — |
| Gehäuse | 324-UBGA (U324), 15 x 15 mm, 0.8 mm pitch | 324-pin UFBGA (U324) |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (industrial, I7) |
| Process Technology | 55 nm NOR-flash-based CMOS | 55 nm NOR flash CMOS |
| Configuration Memory | On-die dual-configuration flash | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Product Family | — | MAX 10 |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks / bits) | — | 246 Kbits |
| User Flash Memory | — | 387,072 bits |
| Maximum User I/O Pins | — | 246 |
| Ball Pitch | — | 0.8 mm |
| Integrated ADC | — | 12-bit SAR, up to 18 channels |
| ADC Sampling Rate | — | 1 MSa/s (single-ended) |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Configuration Modes | — | JTAG, internal flash, external host |
| Core Voltage | — | 3.3 V |
| Lead-Free | — | Yes |