10M08DCU324I7G - MAX 10 FPGA, 8K LE, U324 BGA | Intel
Teilenummer: 10M08DCU324I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $16.5 | $16,50 |
| 10 | $14.85 | $148,50 |
| 100 | $12.95 | $1.295,00 |
| 500 | $11.2 | $5.600,00 |
| 1.000 | $9.85 | $9.850,00 |
| 3.000 | $8.5 | $25.500,00 |
10M08DCU324I7G Übersicht
A field programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that can be re-programmed to implement arbitrary digital logic. FPGAs occupy a unique position in the silicon hierarchy between fixed-function ASICs and software-driven microcontrollers: they deliver parallel hardware performance and deterministic latency without the NRE cost of an ASIC, while providing far more flexibility than a microcontroller for custom I/O timing, wide datapaths, or high-speed interface bridging. The MAX 10 family specifically targets low-power, small-form-factor, and cost-sensitive applications that benefit from non-volatile instant-on behavior.
Key specifications of the 10M08 include up to 246 user I/Os, an embedded 12-bit ADC with up to 18 analog inputs, on-die temperature-sensing diode, hardware multipliers, and a 3.3 V core / LVCMOS I/O architecture supporting LVDS, LVTTL, and LVCMOS standards. The device supports configuration via JTAG, internal flash, or external host, and includes user flash memory (UFM) for non-volatile data storage such as calibration constants or serial numbers.
The architecture pairs a 4-input look-up table (LUT) based logic fabric with embedded memory blocks (M9K), 18x18 multipliers, and a programmable interconnect network. The integrated ADC samples at up to 1 MSa/s in single-ended mode, while dual-boot flash enables fail-safe field updates. Compared with SRAM-based competitors, the on-die flash removes the need for an external boot PROM, reducing BOM cost and board area by roughly one to two square centimeters.
Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image aggregation, low-cost PCIe endpoint prototyping, and system management in telecom or server backplanes. The on-die flash and instant-on capability also make the device attractive for use as a replacement for legacy CPLDs plus discrete ADCs in power-sequencing, fan control, and board-management controller designs.
When designing with this device, pay attention to UFBGA-324 PCB layout requirements: microvia or via-in-pad technology is recommended for the 0.8 mm ball pitch escape, and at least four routing layers with a continuous ground plane are required to maintain signal-integrity margins on LVDS and DDR interfaces. Quartus Prime (Lite or Standard edition) is the supported development environment for synthesis, place-and-route, and programming.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical layout notes not collated on a single manufacturer page, helping engineers shorten the bill-of-materials evaluation cycle.
Drop-in-Alternativen für 10M08DCU324I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M08DCU324I7G (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Operating Temperature, Mounting Type, Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M08DCU324A7G
✅ Drop-In✓ Auf Lager
$25.1 / Stück
Datenblatt ansehen →10M08DAU324I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$22.1 / Stück
Datenblatt ansehen →10M16DCU324I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$40.1 / Stück
Datenblatt ansehen →10M25DCU324I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M04DCU324I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9.15 / Stück
Datenblatt ansehen →10M08DCU324C8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M08DCU324I7G Grenzwerte & elektrische Eigenschaften
| Product Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks / bits) | 246 Kbits |
| User Flash Memory | 387,072 bits |
| Maximum User I/O Pins | 246 |
| Gehäuse | 324-pin UFBGA (U324) |
| Ball Pitch | 0.8 mm |
| Process Technology | 55 nm NOR flash CMOS |
| Integrated ADC | 12-bit SAR, up to 18 channels |
| ADC Sampling Rate | 1 MSa/s (single-ended) |
| Configuration Modes | JTAG, internal flash, external host |
| Core Voltage | 3.3 V |
| Betriebstemperatur | -40C to +100C (industrial, I7) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Montageart | Surface Mount (BGA) |
10M08DCU324I7G 324-pin ufbga (u324) Pinbelegungsleitfaden
Pinbelegung für 10M08DCU324I7G (324-pin ufbga (u324)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M08DCU324I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M08DCU324I7G ist geeignet für 6 Anwendungs: Industrial Motor Control and Drive I/O Expansion, Board Management Controller / System Management, Video Bridging and Image Aggregation, Low-Cost PCIe Endpoint Prototyping, Legacy CPLD Replacement with ADC Integration, Automotive Body Electronics and Driver Assistance.
Industrial Motor Control and Drive I/O Expansion
The 10M08DCU324I7G fits industrial motor-control and I/O-expansion designs where deterministic low-latency logic is required alongside non-volatile instant-on configuration. The 8,000 logic elements provide ample headroom for custom PWM modulators, encoder decoding, and fieldbus glue logic such as EtherCAT or PROFIBUS side-channels. The on-die 12-bit ADC samples up to 1 MSa/s, enabling current-sense and back-EMF monitoring without a separate ADC chip. Compared with a discrete MCU plus CPLD solution, integrating both into a single MAX 10 device reduces board area by roughly 30 to 40 percent and eliminates configuration-PROM complexity. Quartus Prime Lite supports the typical IP cores needed for industrial motor-control reference designs.
Empfohlen
Board Management Controller / System Management
The MAX 10 architecture is purpose-built for board-management-controller (BMC) and system-management roles in telecom, server, and networking hardware. The on-die NOR flash enables CPLD-style instant-on within milliseconds of power-up, which is critical for sequencing power rails, monitoring fans, and asserting resets before a baseboard management controller boots. The integrated 12-bit ADC aggregates rail voltages, temperatures, and fan tachometer inputs, removing a dedicated ADC IC from the BOM. The U324 package supports the 246 I/O count needed for mid-complexity backplane management, and vertical migration to 10M16 or 10M25 in the same U324 footprint lets designers reuse the PCB across product variants.
Empfohlen
Video Bridging and Image Aggregation
The 10M08DCU324I7G serves as a cost-effective bridge between image sensors, parallel RGB/CMOS interfaces, and downstream processors in industrial camera, kiosk, and machine-vision applications. The 8K LE fabric and embedded multipliers handle pixel-rate color-space conversion, gamma correction, and limited compression at resolutions up to 1080p60. LVDS I/O support allows direct connection to flat-panel displays or serializer/deserializer (FPD-Link) channels. Because the part is non-volatile, the bridging logic comes up immediately at power-on, eliminating display-mux glitches during system boot. The U324 footprint provides enough I/O for dual-channel LVDS input and output plus control GPIOs.
Empfohlen
Low-Cost PCIe Endpoint Prototyping
The MAX 10 supports PCIe hard IP in higher-density device variants, and the 10M08DCU324I7G can implement Gen1/Gen2 endpoint prototyping for low-bandwidth add-in cards, IO modules, and industrial PCs. The integrated transceivers (where present in the family) plus the soft PCI Express IP core support x1 lane operation at 2.5 GT/s or 5 GT/s. The 8K LE fabric is sufficient for low-density endpoint functions such as GPIO expansion, I2C/SPI bridging, or basic data acquisition. Designers evaluating PCIe validation can use the same U324 footprint across 10M08, 10M16, and 10M25 to scale logic density without re-spinning the board.
Empfohlen
Legacy CPLD Replacement with ADC Integration
The 10M08DCU324I7G is an ideal modernization path for designs that currently use a CPLD (such as MAX II or MAX V) plus a separate external ADC. The on-die 12-bit ADC replaces the standalone ADC, and the 8K logic fabric replaces the CPLD logic in a single package. Designers benefit from a smaller BOM, lower quiescent current, and the option to add soft-processor cores such as Nios II for housekeeping tasks. The U324 footprint is pin-compatible with other MAX 10 density options, enabling a clean migration path from the legacy CPLD design to a higher-density MAX 10 if feature growth demands it.
Empfohlen
Automotive Body Electronics and Driver Assistance
For automotive applications such as body-control modules, lighting controllers, and sensor aggregation, the 10M08DCU324I7G (industrial grade) is a stepping stone to the AEC-Q100-qualified 10M08DCU324A7G variant in the identical U324 package. The non-volatile configuration supports the instant-on behavior needed for body-electronics wake-up, while the embedded ADC handles sensor inputs such as temperature, lighting, and battery monitoring. Designers can prototype on industrial-grade parts and migrate to automotive-grade silicon for production without changing the PCB layout. The MAX 10 AEC-Q100 qualification covers the operating temperature range from -40C to +125C required for under-hood and cabin deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M08DCU324I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M08DCU324A7G | 10M08DAU324I7G | 10M16DCU324I7G | 10M25DCU324I7G | 10M04DCU324I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-pin UFBGA (U324) | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same |
| Logic Elements | 8,000 LE | 8,000 LE | 8,000 LE | 16,000 LE | 25,000 LE | 4,000 LE |
| Temperature Grade | Industrial (-40C to +100C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory | 246 Kbits | 246 Kbits | 246 Kbits | 504 Kbits | 675 Kbits | 189 Kbits |
| User Flash | 387 Kbits | 387 Kbits | 387 Kbits | 585 Kbits | 788 Kbits | 295 Kbits |
| Maximum User I/O | 246 | 246 | 246 | 246 | 246 | 246 |
| Integrated ADC | 12-bit SAR, 18 channels | 12-bit SAR, 18 channels | 12-bit SAR, 18 channels | 12-bit SAR, 22 channels | 12-bit SAR, 26 channels | 12-bit SAR, 14 channels |
| AEC-Q100 Qualified | No (industrial grade) | Yes | No | No | No | No |
Wichtigste Unterscheidungsmerkmale
- On-die NOR flash configuration eliminates external boot PROM (vs. SRAM-based competitors (Xilinx XC7A35T, Lattice ECP5))
- Integrated 12-bit SAR ADC with up to 18 analog inputs (vs. Xilinx XC7A35T (no on-die ADC))
- Pin-to-pin vertical migration across the MAX 10 family (vs. Lattice MachXO2-1200 (separate package per density))
Designhinweise
The U324 package uses a 0.8 mm ball pitch and a 15x15 ball array with depopulated outer rows. Microvia or via-in-pad technology is recommended for the breakout, and at least four PCB routing layers are needed to escape BGA balls cleanly. A continuous ground reference plane directly under the BGA is critical for LVDS and DDR signal-integrity margins; a split or discontinuous plane under the device can cause impedance discontinuities greater than 15 percent. Estimated: the PCB stackup should target a 50 ohm single-ended / 100 ohm differential impedance for LVDS pairs, with via stubs kept below 0.3 mm for signal rise times under 200 ps.
MAX 10 devices require multiple supply rails: a 3.3 V core/analog supply, a separate 2.5 V or 1.2 V auxiliary supply depending on the variant, and per-bank VCCIO supplies. Decoupling follows the standard Intel FPGA guideline: at least one 100 uF bulk capacitor per supply rail near the device, plus 0.1 uF and 1 nF ceramic capacitors distributed around the BGA periphery with one pair per eight balls. Power-up sequencing requirements are relaxed compared with SRAM-based FPGAs because configuration is stored in flash, but ramp rates should still meet the 0.5 to 100 ms VCCIO specification to avoid POR glitches.
Differential-pair routing for LVDS must maintain less than 10 mil length mismatch within each pair and less than 50 mil mismatch between pairs to meet the MAX 10 LVDS skew budget. The Quartus Prime Fitter reports timing margin after place-and-route; designers should target at least 200 ps of setup margin on all source-synchronous interfaces to absorb PCB tolerances across temperature. The on-die temperature-sensing diode should be routed to dedicated JTAG pins (TDI/TDO) with no series resistance, enabling thermal profiling via Quartus during board bring-up.
A frequent pitfall when migrating from MAX II/V CPLDs to MAX 10 is omitting the JTAG chain pull-up on TCK and TMS. MAX 10 expects an external 1 to 4.7 kohm pull-up on TMS to keep the TAP controller in a defined state during power-up; without it, configuration can fail intermittently. Another common mistake is using single-ended clocking on LVDS receiver inputs - MAX 10 LVDS receivers require the complementary input to be AC-coupled or properly biased. Finally, the user flash memory (UFM) has a 100,000-erase-cycle endurance rating; using it as general-purpose storage in high-write-rate applications will shorten device lifetime.
Compliance-Informationen
Standard industrial MAX 10 OPN. For AEC-Q100 automotive qualification in the same U324 footprint, choose 10M08DCU324A7G. Lead-free matte-tin balls; tray packing per JEDEC tray standard.
