10M25DAF484I7G vs 10M25DAF484C8G Vergleich
Detaillierter Direktvergleich von 10M25DAF484I7G von Intel und 10M25DAF484C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DAF484I7G | 10M25DAF484C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $99,80 | $50,00 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | — |
| Embedded Memory (bits) | 691,200 | — |
| User I/Os | 360 | — |
| Gehäuse | 484-FBGA (FBGA) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V | — |
| Speed Grade | I7 | -8 |
| Temperature Grade | Industrial (-40 C to +100 C ambient) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Tray / Reel | Tray | — |
| 18 x 18 Multipliers | 66 | — |
| PLLs | 2 | Yes (up to 4 analog PLLs per device) |
| On-chip Configuration Flash | Dual (instant-on, dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 25,000 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Betriebstemperatur | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| MSL-Level | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |