10M25DAF484I7G vs 10M25DAF484C8G 对比
详细并排对比 10M25DAF484I7G 出自 Intel 和 10M25DAF484C8G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10M25DAF484I7G | 10M25DAF484C8G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $99.80 | $50.00 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | — |
| Embedded Memory (bits) | 691,200 | — |
| User I/Os | 360 | — |
| 封装 | 484-FBGA (FBGA) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V | — |
| Speed Grade | I7 | -8 |
| Temperature Grade | Industrial (-40 C to +100 C ambient) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Tray / Reel | Tray | — |
| 18 x 18 Multipliers | 66 | — |
| PLLs | 2 | Yes (up to 4 analog PLLs per device) |
| On-chip Configuration Flash | Dual (instant-on, dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| RoHS 状态 | Compliant | Compliant |
| Logic Elements | — | 25,000 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| 工作温度 | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| MSL 等级 | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |