10M25DCF484A7G vs 10M50DAF484I7G Vergleich
Detaillierter Direktvergleich von 10M25DCF484A7G von Intel und 10M50DAF484I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DCF484A7G | 10M50DAF484I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $62,50 | $58,20 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 50,000 |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: total Kbits, blocks count] | — |
| Embedded Block RAM | 1,728 Kbit | — |
| Multipliers (18x18) | 81 | — |
| Maximum User I/O | 360 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Gehäuse | 484-ball FBGA (F484) | 484-ball FBGA (F484) |
| Core Voltage | 1.2 V (internal LDO) | — |
| Betriebstemperatur | -40C to +125C (automotive AEC-Q100) | — |
| Speed Grade | -7 | — |
| Configuration Type | Dual flash, internal | — |
| User Flash | 12 Kbit (32 Kbyte user flash; total device flash larger) | — |
| ADC Block | 12-bit, 1 MSPS, 17 channels | — |
| Montageart | Surface Mount | Surface Mount (FBGA) |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Process Technology | — | TSMC 55 nm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| Integrated ADC | — | 12-bit, 1 MSPS, up to 18 channels |
| DSP Blocks | — | 144 (18x18 multipliers) |
| Configuration Mode | — | Single-chip (no external boot device required) |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |