10M50DAF256C8G vs 10M50DAF256I7G Vergleich
Detaillierter Direktvergleich von 10M50DAF256C8G von Intel und 10M50DAF256I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M50DAF256C8G | 10M50DAF256I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $47,85 | $155,20 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | On-chip (4 typical for 10M50 family) |
| Global Clock Networks | 20 | — |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | TSMC 55 nm embedded flash |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Gehäuse | 256-ball FBGA (F256) | 256-LBGA (17 mm x 17 mm) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-20) | — |
| Logic Elements (LE) | — | 50,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M9K bits) | — | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | — | 4 |
| Maximum User I/O | — | 178 |
| Configuration Memory | — | Internal non-volatile flash (dual-boot) |
| Integrated ADC | — | 12-bit SAR, up to 17 analog inputs |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Tray Quantity | — | 90 per tray (typical for 256-BGA) |
| Configuration Mode | — | Internal flash (instant-on) |