10M50DAF256C8G vs 10M50DAF256I7G Comparison
Detailed side-by-side comparison of 10M50DAF256C8G by Intel and 10M50DAF256I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M50DAF256C8G | 10M50DAF256I7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $47.85 | $155.20 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | On-chip (4 typical for 10M50 family) |
| Global Clock Networks | 20 | — |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | TSMC 55 nm embedded flash |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Package | 256-ball FBGA (F256) | 256-LBGA (17 mm x 17 mm) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| MSL Level | 3 (per JEDEC J-STD-20) | — |
| Logic Elements (LE) | — | 50,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M9K bits) | — | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | — | 4 |
| Maximum User I/O | — | 178 |
| Configuration Memory | — | Internal non-volatile flash (dual-boot) |
| Integrated ADC | — | 12-bit SAR, up to 17 analog inputs |
| Operating Temperature | — | -40C to +100C (Industrial) |
| Tray Quantity | — | 90 per tray (typical for 256-BGA) |
| Configuration Mode | — | Internal flash (instant-on) |