10M50DAF256C8G vs 10M50DCF256C7G Vergleich
Detaillierter Direktvergleich von 10M50DAF256C8G von Intel und 10M50DCF256C7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M50DAF256C8G | 10M50DCF256C7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $47,85 | $98,00 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | 2 |
| Global Clock Networks | 20 | 20 |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | 55 nm TSMC |
| Core Voltage | 1.2 V | — |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | -7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to 85C) |
| Gehäuse | 256-ball FBGA (F256) | 256-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | — |
| MSL-Level | 3 (per JEDEC J-STD-20) | — |
| Logic Elements (LE) | — | 50000 |
| Maximum User I/O | — | 178 |
| User Flash Memory | — | 1,677,312 bits (1677 Kb) |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration Memory | — | Internal dual-configuration flash (non-volatile) |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |