10M50DAF256C8G vs 10M50DCF256C7G Comparison
Detailed side-by-side comparison of 10M50DAF256C8G by Intel and 10M50DCF256C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M50DAF256C8G | 10M50DCF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $47.85 | $98.00 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | 2 |
| Global Clock Networks | 20 | 20 |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | 55 nm TSMC |
| Core Voltage | 1.2 V | — |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | -7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to 85C) |
| Package | 256-ball FBGA (F256) | 256-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | — |
| MSL Level | 3 (per JEDEC J-STD-20) | — |
| Logic Elements (LE) | — | 50000 |
| Maximum User I/O | — | 178 |
| User Flash Memory | — | 1,677,312 bits (1677 Kb) |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration Memory | — | Internal dual-configuration flash (non-volatile) |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |