10M50DCF256C8G vs 10M16DCF256C8G Vergleich
Detaillierter Direktvergleich von 10M50DCF256C8G von Intel und 10M16DCF256C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M50DCF256C8G | 10M16DCF256C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,85 | $17,10 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 16000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | — |
| User Flash Memory | 1,677,312 bits | — |
| DSP Blocks (18x18 Multipliers) | 172 | — |
| Maximum User I/O Pins | 178 | — |
| Gehäuse | 256-pin FBGA (FBGA256), 17x17 mm | 256-ball FineLine BGA (FBGA), 17 x 17 mm |
| Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 8 | C8 |
| PLLs | 4 | — |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm |
| Core Voltage | 1.0 V (internal) | 1.2 V |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Maximum User I/O | — | 178 |
| Embedded SRAM | — | 562176 bits (562 Kbit) |
| User Flash | — | 5140 Kbit (5.14 Mbit) |
| Configuration Type | — | Dual-configuration flash (DC) |
| Maximum Operating Frequency | — | 472.5 MHz |
| Betriebstemperatur | — | 0 °C to +85 °C (commercial) |
| Non-volatile Configuration | — | Yes (on-chip flash) |