10M16DCF256C8G - MAX 10 FPGA 16K LE 256-FBGA | Intel / Altera
Teilenummer: 10M16DCF256C8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $27.5 | $27,50 |
| 10 | $24.8 | $248,00 |
| 100 | $21.95 | $2.195,00 |
| 500 | $19.4 | $9.700,00 |
| 1.000 | $17.1 | $17.100,00 |
10M16DCF256C8G Übersicht
A MAX 10 FPGA is a non-volatile field programmable gate array from Intel that integrates the configuration flash and an optional 12-bit 1 MSPS ADC directly on-chip, removing the need for an external boot PROM. Within the broader Intel programmable-logic hierarchy, MAX 10 sits below the low-cost Cyclone family and above the legacy MAX II/MAX V CPLD families, often replacing systems that previously combined a CPLD with a small SRAM-based FPGA. The '10M16' part number encodes 16,000 logic elements, and the 'D' prefix denotes the dual-image flash configuration variant, supporting field firmware updates and fail-safe fallback.
Key differentiating features include 16,000 logic elements, 178 maximum user I/O, 562 Kbit embedded SRAM, 5,140 Kbit user flash, integrated dual-configuration flash, optional 12-bit 1 MSPS ADC blocks, and instant-on behavior because configuration lives on-die. The 256-ball FineLine BGA package provides high I/O density in a 17 x 17 mm footprint, suitable for space-constrained industrial control boards. According to the Intel MAX 10 datasheet, the device is supported by Quartus Prime design software with synthesizable IP libraries, reference designs, and validated HDL examples.
Typical applications for the 10M16DCF256C8G include industrial motor-control interface bridging, video/image pre-processing, automotive infotainment auxiliary controllers, factory-automation I/O expansion and protocol conversion, and portable medical-device controller boards. The integrated ADC block makes the family particularly attractive for sensor aggregation front-ends, while the dual-configuration flash supports A/B firmware upgrades without external memory.
When designing with this part, allocate adequate BGA breakout and at least four PCB layers for power and ground planes. The 1.2 V core supply typically requires an external LDO or DC-DC regulator with bulk decoupling placed within 10 mm of the FBGA balls to maintain signal integrity on the 178 user I/O at typical 100 MHz LVCMOS/LVDS toggle rates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für 10M16DCF256C8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M16DCF256C8G (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements (LE), Speed Grade, Operating Temperature, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M25DCF256C8G
✅ Drop-In✓ Auf Lager
$24.95 / Stück
Datenblatt ansehen →10M08DCF256C8G
✅ Drop-In✓ Auf Lager
$2.28 / Stück
Datenblatt ansehen →10M50DCF256C8G
✅ Drop-In✓ Auf Lager
$52.85 / Stück
Datenblatt ansehen →10M40DCF256C8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$71.8 / Stück
Datenblatt ansehen →10M16DCF256A7G
✅ Drop-In✓ Auf Lager
$37.2 / Stück
Datenblatt ansehen →10M16DCF256C8G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements (LE) | 16000 |
| Maximum User I/O | 178 |
| Embedded SRAM | 562176 bits (562 Kbit) |
| User Flash | 5140 Kbit (5.14 Mbit) |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Speed Grade | C8 |
| Configuration Type | Dual-configuration flash (DC) |
| Maximum Operating Frequency | 472.5 MHz |
| Gehäuse | 256-ball FineLine BGA (FBGA), 17 x 17 mm |
| Betriebstemperatur | 0 °C to +85 °C (commercial) |
| Montageart | Surface Mount |
| Non-volatile Configuration | Yes (on-chip flash) |
| RoHS-Status | Compliant |
10M16DCF256C8G 256-ball fineline bga (fbga), 17 x 17 mm Pinbelegungsleitfaden
Pinbelegung für 10M16DCF256C8G (256-ball fineline bga (fbga), 17 x 17 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M16DCF256C8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M16DCF256C8G ist geeignet für 6 Anwendungs: Industrial Motor-Control Interface Bridge, Video and Image Pre-Processing, Automotive Infotainment Auxiliary Controller, Factory-Automation I/O Expansion and Protocol Conversion, Portable Medical-Device Controller, Sensor Aggregation Front-End.
Industrial Motor-Control Interface Bridge
The 10M16DCF256C8G fits industrial motor-control bridging because its 16,000 logic elements can host encoder interfaces (QEI/Hall), PWM generators, and field-oriented-control pre-processing, while 178 user I/O exposes enough pins for multi-axis systems. The integrated 12-bit ADC block in MAX 10 simplifies current-sense sampling without an external ADC. Placed between a microcontroller and the power stage, it offloads deterministic timing tasks; instant-on from dual-configuration flash avoids boot delays on factory reset.
Empfohlen
Video and Image Pre-Processing
The 10M16DCF256C8G's 16,000 LEs and 562 Kbit embedded SRAM suit video pre-processing such as color-space conversion, frame buffering for small LCDs, and simple image filters where latency must be deterministic. With 178 user I/O, designers can route parallel RGB or MIPI-style interfaces without external bus muxes. Used in tandem with an external image sensor, it handles timing-critical tasks before a host processor; its 1.2 V core keeps power low versus SRAM-based FPGAs of similar density.
Empfohlen
Automotive Infotainment Auxiliary Controller
The 10M16DCF256C8G works as an auxiliary controller in automotive infotainment systems where it bridges CAN/LIN buses, manages display backlight, and sequences audio CODEC power rails. Its dual-configuration flash supports secure A/B firmware updates mandated by automotive OEMs. With 178 user I/O and LVDS/LVCMOS support, it interfaces directly to display and audio peripherals; instant-on from on-chip flash ensures sub-100 ms wake-up from ignition key-on events.
Empfohlen
Factory-Automation I/O Expansion and Protocol Conversion
In factory automation, the 10M16DCF256C8G provides I/O expansion and protocol bridging (RS-485 to Ethernet, Modbus to PROFINET, parallel GPIO to EtherCAT) with deterministic latency. Its 178 user I/O accommodates large multi-drop fieldbus nodes, and the integrated ADC reads 4-20 mA sensor inputs directly. With on-chip flash, no external boot device is needed on DIN-rail-mounted PLCs; dual-configuration supports safe firmware rollback in unattended factory deployments.
Empfohlen
Portable Medical-Device Controller
The 10M16DCF256C8G suits portable medical devices such as handheld patient monitors and infusion-pump controllers where its 1.2 V core minimises battery drain and on-chip flash enables instant-on at power-button press. The 16,000 LEs support sensor fusion, LCD driving, and USB-CDC bridging, while 178 user I/O accommodates keypad, display, and BLE module connections. Dual-configuration flash permits validated firmware updates per medical-device regulatory flows.
Empfohlen
Sensor Aggregation Front-End
The 10M16DCF256C8G is a strong fit for sensor-aggregation front-ends because its integrated 12-bit 1 MSPS ADC (per MAX 10 family feature) samples multiple analog sensors without an external ADC chip. The 16,000 LEs implement digital filtering, threshold detection, and protocol framing in a single device, while 178 user I/O accommodates SPI/I2C sensor clusters. With on-chip flash and 0-85 °C rating, it is ideal for industrial sensor hubs with deterministic response.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M16DCF256C8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M25DCF256C8G | 10M08DCF256C8G | 10M50DCF256C8G | 10M16DCF256A7G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA (FBGA), 17 x 17 mm | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same |
| Logic Elements | 16000 | 25000 | 8000 | 50000 | 16000 |
| Maximum User I/O | 178 | 178 | 178 | 178 | 178 |
| Embedded SRAM | 562 Kbit | 675 Kbit | 378 Kbit | 1638 Kbit | 562 Kbit |
| User Flash | 5140 Kbit | 5940 Kbit | 3040 Kbit | 5940 Kbit | 5140 Kbit |
| Configuration Type | Dual-configuration flash (DC) | Dual-configuration flash (DC) | Dual-configuration flash (DC) | Dual-configuration flash (DC) | Dual-configuration flash (DC) |
| Speed Grade | C8 | C8 | C8 | C8 | A7 (slower) |
Wichtigste Unterscheidungsmerkmale
- Mid-density 16K-LE part in 256-FBGA with on-chip dual-configuration flash (vs. 10M08DCF256C8G)
- Lower cost than higher-density MAX 10 variants (vs. 10M25DCF256C8G)
- C8 speed grade offers higher Fmax than A7 speed grade (vs. 10M16DCF256A7G)
Designhinweise
Estimated: the 256-ball FineLine BGA at 17 x 17 mm with a 1.0 mm ball pitch requires at least 4 PCB layers with continuous power and ground planes for signal-integrity on the 178 user I/O at 100 MHz LVCMOS toggle rates. Place 0.1 µF + 10 µF bulk decoupling within 10 mm of each VCCINT/VCCIO ball cluster. Microvia or via-in-pad is recommended for BGA breakout to keep fanout within the BGA escape region.
Estimated: at 1.2 V core supply and typical MAX 10 dynamic current around 100-200 mA active plus 178 I/O toggling, budget 500 mA peak for the core LDO or DC-DC regulator. Use a low-noise LDO (e.g., TPS7A4701-class) if analog ADC accuracy matters, otherwise a TPS54331-class DC-DC suffices for FPGA logic-only rails. Place a ferrite bead between the 1.2 V digital and any 1.2 V analog supply if the integrated ADC is used.
Do not confuse 'DC' (dual-configuration) with 'SA' (single-image analog) variants - they have different configuration flash sizes. Verify JTAG pin connections (TCK/TMS/TDO/TDI) per the MAX 10 handbook pinout chapter, as some boards misroute TCK to a non-5 V-tolerant GPIO. For dual-configuration designs, plan both image sizes to fit in the user flash partition table defined by Quartus Prime programming files.
Compliance-Informationen
RoHS and REACH compliant per Intel/Altera product page. Commercial 0-85 °C temperature grade; industrial -40 to 100 °C variants are available with 'I' suffix ordering codes.
