10M50DCF484I6G vs 10M50DAF484C7G Vergleich
Detaillierter Direktvergleich von 10M50DCF484I6G von Intel und 10M50DAF484C7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M50DCF484I6G | 10M50DAF484C7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,75 | $65,80 |
| Family | MAX 10 FPGA | — |
| Logic Elements | 50,000 | 50,000 |
| Adaptive Logic Modules (ALMs) | 25,000 | — |
| Embedded Memory (RAM) | 1,638 Kbit | — |
| User Flash | 512 Kbyte (4,096 Kbit) | — |
| Total Embedded Memory | 2,140 Kbit (RAM + UFM) | — |
| 18x18 Multipliers | 144 | — |
| General-Purpose PLLs | 4 | — |
| Global Clock Networks | 20 | [DATA_NEEDED: global clocks count] |
| Hard PCIe Gen2 Controllers | 1 (x1) | — |
| On-chip ADC | 12-bit, 1 Msps SAR, up to 18 channels | — |
| User I/O Pins | 360 | — |
| Supply Voltage - Core | 1.2 V | — |
| Supply Voltage - I/O | 1.2 V to 3.3 V | — |
| Betriebs-Sperrschichttemperatur | -40C to +100C (industrial) | — |
| Gehäuse | 484-ball FineLine BGA (F484) | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Configuration Memory | On-chip non-volatile (dual image) | Non-volatile embedded flash (dual-configuration) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Product Type | — | FPGA (Field-Programmable Gate Array) |
| Series | — | MAX 10 |
| Embedded Memory | — | 1,677,312 bits (approximately 1.6 Mbit) |
| Embedded 18x18 Multipliers | — | 312 |
| User Flash Memory | — | [DATA_NEEDED: user flash bits] |
| Number of User I/O | — | 360 |
| Versorgungsspannung | — | 1.2 V core (VCCINT) |
| PLLs | — | 2 |
| ADC | — | Integrated 12-bit SAR, up to 17 channels |
| Betriebstemperatur | — | 0 C to +85 C (commercial grade, C7 speed) |
| Process Technology | — | 55 nm embedded flash CMOS |
| MSL-Level | — | 3 |