5CSEBA4U19I7SN vs 5CSEBA4U19I7LN Vergleich
Detaillierter Direktvergleich von 5CSEBA4U19I7SN von Intel und 5CSEBA4U19I7LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 5CSEBA4U19I7SN | 5CSEBA4U19I7LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $145,00 | $168,00 |
| Series | Cyclone V SE SoC FPGA | — |
| Device Family | Cyclone V | — |
| Logic Elements | 40,000 | 40K |
| Hard Processor System (HPS) | Single ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 800 MHz | 925 MHz |
| Gehäuse | 484-pin UBG A (19x19 mm) | 484-pin UFBGA (19x19 mm, 0.8 mm pitch) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Process Node | 28 nm low-power | — |
| Supply Voltage (Core) | 1.1 V (typical) | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL (Cyclone V I/O family) | — |
| Embedded Memory | [DATA_NEEDED: total Kbits of M9K blocks] | — |
| 18x18 Hardware Multipliers | [DATA_NEEDED: count] | — |
| PLLs | [DATA_NEEDED: count] | [DATA_NEEDED: PLL count per family datasheet] |
| Transceivers | Not applicable (SE family, transceiver-less) | — |
| PCI Express Hard IP | Gen1 capable (rootport/endpoint) | — |
| DDR Memory Support | DDR2/DDR3/LPDDR2 via HPS and FPGA fabric | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | Cyclone V SE SoC FPGA |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| FPGA Logic Performance | — | up to 925 MHz DSP / 300 MHz logic |
| Embedded Memory (M10K) | — | [DATA_NEEDED: total M10K bits] |
| DSP Blocks (18x18 Multipliers) | — | 56 |
| Memory Controller | — | DDR2/DDR3/LPDDR2 with ECC (hardened in HPS) |
| HPS Peripherals | — | UART, SPI, I2C, USB 2.0 OTG, EMAC, SD/MMC, NAND, GPIO |
| Process Technology | — | TSMC 28 nm low-power |
| Operating Temperature (Industrial) | — | -40C to +100C (I7 grade, inferred from MPN suffix) |
| Supply Voltage (core) | — | 1.1 V typical (Cyclone V family) |
| Configuration Scheme | — | Serial (EPCS) or Quad-Serial Flash |