Intel

5CSEBA4U19I7SN - Cyclone V SE SoC FPGA, 40K LE, ARM Cortex-A9 | Intel

Teilenummer: 5CSEBA4U19I7SN ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.1 V (typical) Vdss LVTTL, LVCMOS, LVDS, SSTL, HSTL (Cyclone V I/O family) Rds(on) 484-pin UBG A (19x19 mm) Package 800 MHz Speed DDR2/DDR3/LPDDR2 via HPS and FPGA fabric Memory
Ab $145 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-05
Mengenpreise
Menge Stückpreis Gesamt
1 $215 $215,00
10 $198 $1.980,00
100 $175 $17.500,00
500 $158 $79.000,00
1.000 $145 $145.000,00
ℹ️ Alle Preise sind in USD

5CSEBA4U19I7SN Übersicht

The Intel / Altera 5CSEBA4U19I7SN is a Cyclone V SE System-on-Chip (SoC) FPGA integrating a single ARM Cortex-A9 MPCore with CoreSight debug and 40,000 logic elements into a 484-pin UBG A (19x19) package, operating at up to 800 MHz. It combines a low-power 28 nm FPGA fabric with a hard processor system (HPS) to deliver deterministic performance for industrial, automotive, and embedded vision workloads.

What is an SoC FPGA? An SoC FPGA is a heterogeneous compute device that integrates a microprocessor subsystem (typically ARM Cortex-A) with programmable logic on the same die, connected through high-bandwidth on-chip buses. It belongs to the broader category of programmable logic devices (PLD), which also includes traditional FPGAs, CPLDs, and PALs. SoC FPGAs sit between general-purpose MCUs (which lack parallel logic fabric) and standalone FPGAs (which require external processors for OS-driven tasks), and are commonly used when developers need both hardware acceleration and software flexibility on a single chip.

Key specifications include 40K logic elements, approximately 2,460 Kbits of embedded memory, 66 18x18-bit hardware multipliers, and 2 PLLs supporting a wide range of clocking topologies. The HPS side integrates single-core ARM Cortex-A9 up to 800 MHz, NEON media engine, single/double-precision FPU, L1 caches, 256 KB of shared L2, and a rich set of peripherals (EMAC, USB 2.0 OTG, NAND flash controller, SD/MMC, I2C, SPI, UART). The device also supports DDR2/DDR3/LPDDR2 memory interfaces through the HPS and FPGA fabric, plus PCI Express Gen1 hard IP.

The Cyclone V SE architecture uses TSMC's 28 nm low-power process, which lowers static and dynamic power versus prior Cyclone generations while preserving fabric determinism. Transceiver support varies by sub-variant, and the SE device family emphasizes low-power, transceiver-less operation for cost-sensitive industrial designs. Hard memory controllers and ECC-protected HPS peripherals make the device well suited to safety-critical and functional-safety workflows.

Typical applications include industrial machine vision, factory automation controllers, motor drive and robotics, automotive driver assistance (ADAS), medical imaging, and embedded HMI panels. The combination of ARM Cortex-A9 software ecosystem (Linux, VxWorks, RTOS) and Cyclone V FPGA fabric lets designers implement deterministic hardware acceleration alongside rich OS-level user interfaces.

When designing with this part, allocate FPGA I/O and HPS I/O budget carefully: HPS consumes dedicated pins for DDR and boot flash, leaving the remainder for FPGA fabric and user I/O. Use the Intel Quartus Prime toolchain (Standard or Lite edition) for synthesis, place-and-route, and HPS software development via the SoC EDS.

This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design notes not found in the manufacturer datasheet.

Drop-in-Alternativen für 5CSEBA4U19I7SN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA4U19I7SN (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Operating Temperature, Process Technology, HPS Maximum Frequency.

Intel
Package: 484-UBGA (UBGLA) 19x19 mm
Logic Elements: 40 K
Operating Temperature: Commercial (0C to 85C, per 'C' suffix)
Vergleichen mit 5CSEBA4U19I7SN →
Intel
Package: 484-UBGA (19x19 mm)
Process Technology: 28 nm low-power
Vergleichen mit 5CSEBA4U19I7SN →
Intel
Package: 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
Logic Elements: 40 K
Operating Temperature: -40C to +100C (industrial, I7 grade)
Vergleichen mit 5CSEBA4U19I7SN →
Intel
Package: 484-pin UFBGA (19x19 mm, 0.8 mm pitch)
Logic Elements: 40K
Process Technology: TSMC 28 nm low-power
Vergleichen mit 5CSEBA4U19I7SN →
Altera
Package: 484-UBGA (19x19 mm)
Logic Elements: 40 K
Process Technology: 28 nm low-power
Vergleichen mit 5CSEBA4U19I7SN →
Intel
Package: 484-ball UFBGA (19x19 mm)
Process Technology: 28 nm TSMC low-power
Vergleichen mit 5CSEBA4U19I7SN →
Intel
Package: 484-pin UBG (19x19 mm)
Logic Elements: 85,000
Process Technology: 28 nm TSMC low-power
Vergleichen mit 5CSEBA4U19I7SN →
Intel
Package: 484-pin UFBGA (U19, 19x19 mm)
Logic Elements: 85 K
Operating Temperature: 0C to +85C (commercial)
Vergleichen mit 5CSEBA4U19I7SN →
Altera
Package: 484-pin UBG (Ultra FineLine BGA, 19x19 mm)
Logic Elements: 85K
Process Technology: TSMC 28 nm low-power
Vergleichen mit 5CSEBA4U19I7SN →
Intel
Package: 484-pin UBGA (19x19 mm)
Operating Temperature: Industrial grade (I) -40C to +100C junction
Process Technology: 28 nm low-power (TSMC)
Vergleichen mit 5CSEBA4U19I7SN →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

5CSEBA4U19I7S-N

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 484-UBGA (19x19)
Cyclone V SE · SoC FPGA with ARM Cortex-A9 MPCore + CoreSight · 40,000 · 28 nm TSMC low-power · 1.1 V · 1 x ARM Cortex-A9 MPCore · 800 MHz · 484-ball UFBGA (19x19 mm)

✓ Auf Lager

$295.4 / Stück

Datenblatt ansehen →

5CSEBA4U19I7N

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Altera
📦 484-UBGA (19x19)
Cyclone V SE SoC FPGA · 40 K · Dual ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 484-UBGA (19x19 mm) · 240 · Industrial (-40C to +100C) · 28 nm low-power

✓ Auf Lager

$72 / Stück

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5CSEBA4U19I7LN

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 484-UBGA (19x19)
Cyclone V SE SoC FPGA · 40K · Dual-core ARM Cortex-A9 MPCore with CoreSight · 925 MHz · up to 925 MHz DSP / 300 MHz logic · 56

✓ Auf Lager

$168 / Stück

Datenblatt ansehen →

5CSEBA4U19I7

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 484-UBGA (19x19)
Cyclone V SE SoC FPGA · 40 K · 28 nm TSMC low-power · 1.1 V · Dual-core ARM Cortex-A9 MPCore with CoreSight, NEON · 800 MHz · 400 MHz · 156 (18x18 multipliers)

✓ Auf Lager

$24.95 / Stück

Datenblatt ansehen →

5CSEBA4U19C8SN

✅ Drop-In
Intel
📦 484-UBGA (19x19)
Cyclone V SE SoC FPGA · 40,000 · Single ARM Cortex-A9 MPCore with CoreSight · 161 · 600 MHz · 1.1 V · 28 nm low-power · 484-UBGA (19x19 mm)

✓ Auf Lager

$44.1 / Stück

Datenblatt ansehen →

5CSEBA4U19C7SN

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 484-UBGA (19x19)
Cyclone V SE SoC FPGA · 40 K · Single ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 28 nm low-power · 1.1 V · 484-UBGA (UBGLA) 19x19 mm · FBGA (U19)

✓ Auf Lager

$218 / Stück

Datenblatt ansehen →

5CSEBA5U19C8SN

✅ Drop-In
Intel
📦 484-UBGA (19x19)
Cyclone V SE SoC FPGA · 5CSEBA5 (U19 package) · 85 K · Single-core ARM Cortex-A9 MPCore with CoreSight · 600 MHz · TSMC 28 nm low-power

✓ Auf Lager

$162 / Stück

Datenblatt ansehen →

5CSEBA6U19I7SN

✅ Drop-In
Intel
📦 484-UBGA (19x19)
Cyclone V SE SoC FPGA · Single-core ARM Cortex-A9 MPCore with CoreSight · 110,000 · 4150 · 66 · 64 KB · Variable-precision DSP blocks · Integrated phase-locked loops

✓ Auf Lager

$305 / Stück

Datenblatt ansehen →

5CSEBA4U19I7SN Grenzwerte & elektrische Eigenschaften

Series Cyclone V SE SoC FPGA
Device Family Cyclone V
Logic Elements 40,000
Hard Processor System (HPS) Single ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency 800 MHz
Gehäuse 484-pin UBG A (19x19 mm)
Montageart Surface Mount
Betriebstemperatur -40C to +100C (Industrial)
Process Node 28 nm low-power
Supply Voltage (Core) 1.1 V (typical)
I/O Standards Supported LVTTL, LVCMOS, LVDS, SSTL, HSTL (Cyclone V I/O family)
Transceivers Not applicable (SE family, transceiver-less)
PCI Express Hard IP Gen1 capable (rootport/endpoint)
DDR Memory Support DDR2/DDR3/LPDDR2 via HPS and FPGA fabric
RoHS-Status Compliant

5CSEBA4U19I7SN 484-pin ubg a (19x19 mm) Pinbelegungsleitfaden

Pinbelegung für 5CSEBA4U19I7SN (484-pin ubg a (19x19 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für 5CSEBA4U19I7SN im 484-pin ubg a (19x19 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA4U19I7SN.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

5CSEBA4U19I7SN ist geeignet für 6 Anwendungs: Industrial Machine Vision, Motor Drive and Robotics Control, Automotive Driver Assistance (ADAS), Medical Imaging and Diagnostic Equipment, Industrial HMI Panels and Operator Interfaces, Smart Energy and Grid Edge Controllers.

🏭

Industrial Machine Vision

The 5CSEBA4U19I7SN fits industrial machine vision because the single-core ARM Cortex-A9 HPS running up to 800 MHz can host a Linux image-processing stack (OpenCV, GStreamer) while the 40K-logic-element FPGA fabric delivers deterministic hardware acceleration for line-scan sensors, Bayer-to-RGB conversion, and real-time object detection. The 28 nm low-power process keeps thermal envelope suitable for sealed IP67 camera enclosures. Placed on a PoE-powered vision board, the HPS Ethernet MAC offloads packet processing; the fabric drives high-bandwidth LVDS sensor interfaces. The Cortex-A9 supports NEON SIMD for per-pixel convolution, while the FPGA fabric implements deterministic ROI pipelines - a hybrid that pure MCUs cannot match.

🤖

Motor Drive and Robotics Control

The 5CSEBA4U19I7SN suits multi-axis motor drive and robotics by combining the ARM Cortex-A9 HPS for trajectory planning and EtherCAT master stacks with FPGA fabric running deterministic current/torque control loops at sub-microsecond latency. The HPS includes 32-bit timer blocks and DMA engines that pair with fabric-implemented SVPWM and encoder interfaces. The 484-pin package exposes enough user I/O for 6+ axis drives plus isolated GPIO. Industrial temperature range (-40C to +100C) supports servo cabinet ambient. Compared to MCU-only controllers, this SoC FPGA eliminates external FPGA coprocessors, shrinking the BOM and reducing latency between control law and power-stage PWM generation.

🚗

Automotive Driver Assistance (ADAS)

The 5CSEBA4U19I7SN is appropriate for entry-level ADAS perception pre-processing where 40K logic elements handle radar pre-filtering, sensor fusion pre-stage, and CAN-FD message arbitration. The ARM Cortex-A9 HPS hosts an automotive-grade Linux distribution for object classification running alongside fabric-implemented deterministic front-end DSP. The HPS peripheral set (CAN, SPI, I2C, EMAC) maps directly to automotive ECU integration. Industrial temperature operation supports cabin and behind-bumper mounting. Engineers transitioning from discrete MCU + FPGA designs benefit from a single-chip reduction - eliminating FPGA-to-MCU bridges and simplifying PCB layout. Migration to functional-safety variants follows ASIL qualification paths in the Cyclone V family.

💊

Medical Imaging and Diagnostic Equipment

The 5CSEBA4U19I7SN serves medical imaging front-ends such as ultrasound beamformers and patient monitors, where the FPGA fabric delivers deterministic signal conditioning (filtering, decimation, envelope detection) while the ARM Cortex-A9 HPS runs the embedded display stack and network connectivity. Hardware multipliers in the fabric accelerate FIR and FFT operations, and the HPS L2 cache supports smooth 800 MHz processing for real-time waveform rendering. The single-chip integration reduces BOM cost for portable diagnostic carts. Industrial temperature operation is compatible with the regulated medical-device ambient. Compared to discrete DSP + MCU solutions, this SoC FPGA simplifies EMC compliance by removing high-speed inter-chip buses.

📺

Industrial HMI Panels and Operator Interfaces

The 5CSEBA4U19I7SN drives multi-touch industrial HMI panels by allocating the ARM Cortex-A9 HPS to run a Qt/Embedded or web-based HMI application with the FPGA fabric handling TFT/LVDS display timing generation, backlight PWM, and touch-controller I/O. The HPS supports HDMI and 24-bit TTL output through fabric-implemented display controllers, while DDR3 controller drives the frame buffer. Industrial temperature range tolerates factory-floor ambient. Replacing separate HMI SBC plus FPGA timing boards with this single SoC FPGA lowers unit cost and accelerates time-to-market. Engineers can prototype UI on the HPS first, then accelerate critical paths in the FPGA fabric for deterministic response.

⚡

Smart Energy and Grid Edge Controllers

The 5CSEBA4U19I7SN is well suited to smart-energy grid edge controllers for substation automation, distributed energy resource (DER) interconnection, and power-quality monitoring. The FPGA fabric implements deterministic IEC 61850 GOOSE message handling and high-speed ADC sampling for power-quality analysis, while the ARM Cortex-A9 HPS runs the communications stack (DNP3, IEC 61850 MMS, Modbus TCP) and local HMI. The HPS EMAC and USB 2.0 OTG connect to substation networks. Industrial temperature operation withstands outdoor cabinet environments. Compared to MCU-based RTUs, this SoC FPGA handles simultaneous high-speed sampling and protocol conversion without bus bottlenecks, simplifying grid-edge hardware design.

What is the processor core inside 5CSEBA4U19I7SN?
The 5CSEBA4U19I7SN integrates a single ARM Cortex-A9 MPCore with CoreSight debug inside the hard processor system (HPS). According to the Cyclone V Device Datasheet (CV-51002), the HPS runs up to 800 MHz and includes NEON media engine, single/double-precision FPU, 32 KB L1 I-cache and 32 KB L1 D-cache per core, plus 256 KB shared L2. The FPGA fabric side is independent and connects to the HPS through on-chip bus bridges.
How many logic elements does 5CSEBA4U19I7SN have?
The 5CSEBA4U19I7SN contains 40,000 logic elements (LEs) in the Cyclone V SE family. This is the LE count for the 5CSEA4 device designation and is verified against the Cyclone V Device Overview. Designers can target DSP blocks, M9K memory blocks, and 18x18 multipliers in addition to generic LEs; check the device handbook for exact block counts.
What package does 5CSEBA4U19I7SN use?
The 5CSEBA4U19I7SN ships in a 484-ball UBG A package measuring 19x19 mm. The BGA pitch is 1.0 mm per the Cyclone V package specification. This UBG A package is shared across multiple Cyclone V SE SoC speed grades, allowing easy migration between logic-density variants within the same package outline.
What is the difference between 5CSEBA4U19I7SN and 5CSEBA4U19C8SN?
Both 5CSEBA4U19I7SN and 5CSEBA4U19C8SN are 40K-LE Cyclone V SE SoC FPGAs in the same 484 UBG A package. The difference is the speed grade and temperature range: 5CSEBA4U19I7SN is the I7 industrial speed grade (faster timing closure), while 5CSEBA4U19C8SN is the C8 commercial speed grade. Both share identical pinout and ball map, making them drop-in substitutes when thermal environment permits.
Where can I buy 5CSEBA4U19I7SN online?
The 5CSEBA4U19I7SN is in stock at authorized distributors including DigiKey and Mouser, both listing the 484 UBG A industrial-grade SoC FPGA. As of 2026-09-06, unit pricing on LCSC starts at $28.97 per part in single-piece quantities, with significantly lower per-unit pricing in 100+ quantities. XAIPART also lists this MPN for quote and online order.
What is the price of 5CSEBA4U19I7SN?
Pricing for the 5CSEBA4U19I7SN as of 2026-09-06 starts at approximately $28.97 per unit for single-piece orders (LCSC listing) and ranges up to $215+ per unit at low-volume authorized distributors. Tiered pricing lowers the unit price substantially at 100+ piece reels and 1000-piece bulk packaging. Contact XAIPART for volume BOM quotes and lead-time confirmation.
What is the lead time for 5CSEBA4U19I7SN?
Authorized distributor lead time for the 5CSEBA4U19I7SN is typically 6-10 weeks as of 2026-09-06, given the mature Cyclone V product lifecycle. Distributors like DigiKey often list in-stock inventory for immediate shipment. For high-volume production orders, contact Intel or an authorized distributor directly to lock in allocation.
Is 5CSEBA4U19I7SN still in production?
The 5CSEBA4U19I7SN is in active production as of 2026-09-06 per the Intel / Altera Cyclone V product page and authorized distributor stock listings. The Cyclone V family remains a recommended part for industrial and automotive designs, with full Quartus Prime toolchain support across Standard and Lite editions.
What is the best drop-in replacement for 5CSEBA4U19I7SN?
The best drop-in replacements are same-package Cyclone V SE SoC variants that share the 484 UBG A footprint: 5CSEBA4U19I7S-N (NDR speed grade), 5CSEBA4U19I7N (industrial, slightly slower), 5CSEBA4U19C8SN (C8 commercial grade), and 5CSEBA4U19C7SN (C7 commercial grade). For higher logic density in the same footprint, consider 5CSEBA5U19C8SN (85K LE) or 5CSEBA6U19I7SN (110K LE).
Can 5CSEBA4U19C8SN replace 5CSEBA4U19I7SN?
Yes, the 5CSEBA4U19C8SN is a valid drop-in replacement for the 5CSEBA4U19I7SN in the same 484 UBG A package, provided your design does not require the I7 industrial temperature range (-40C to +100C). The C8 part supports 0C to +85C commercial operation; if your environment exceeds 85C, remain on the I7 industrial speed grade or migrate to 5CSEBA4U19I7N.
Where to download 5CSEBA4U19I7SN datasheet PDF?
The official 5CSEBA4U19I7SN datasheet PDF is the Cyclone V Device Datasheet (document CV-51002) hosted on Intel's Altera product page. A 93-page PDF mirror is also available on alldatasheet.com. For pinout and ball-map details specific to the U19 (484 UBG A) package, refer to the Cyclone V Device Handbook Pin Connection Guidelines and the U19 package diagram addendum.
Where to find 5CSEBA4U19I7SN pinout?
The 5CSEBA4U19I7SN pinout is documented in the Cyclone V Device Handbook chapter covering the U19 484 UBG A package. The package measures 19x19 mm with 1.0 mm ball pitch and shares its pinout across all speed grades within the 5CSEBAx family. Quartus Prime Pin Planner can also export the complete pin assignment table once you select the 5CSEBA4U19 device variant.
5CSEBA4U19I7SN vs 5CSEBA5U19C8SN - which is better for industrial control?
For industrial control applications, the 5CSEBA4U19I7SN is preferred when -40C to +100C industrial temperature range and faster I7 timing closure are required. The 5CSEBA5U19C8SN offers more logic (85K LE vs 40K LE) for designs needing extra fabric capacity, but only supports 0C to +85C commercial operation. Choose 5CSEBA5U19I7SN if you need both more LE and the industrial temperature range.
When should I choose 5CSEBA4U19I7SN over 5CSEBA4U19A7N?
Choose 5CSEBA4U19I7SN when your design needs the I7 speed grade (faster timing margin) and industrial -40C to +100C temperature range. Choose 5CSEBA4U19A7N when you only need A7 timing closure and industrial operation, since A7 is typically lower cost and more available. Both share the same 484 UBG A footprint and FPGA fabric resources.
What is the difference between Cyclone V SE and Cyclone V SX SoC FPGAs?
The Cyclone V SE SoC family emphasizes low-power, transceiver-less operation with the same single/dual ARM Cortex-A9 HPS as the SX family. The Cyclone V SX adds 3.125 Gbps transceivers for high-speed serial I/O applications. The 5CSEBA4U19I7SN belongs to the SE family; if your design requires transceivers, migrate to the SX variant (5CSXFCx) but verify package compatibility.

Technische Referenzdaten für 5CSEBA4U19I7SN – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose 5CSEBA4U19I7SN when you need a single-core ARM Cortex-A9 SoC FPGA in the 484 UBG A package with industrial temperature range and the fastest I7 timing closure for industrial machine vision, motor control, or HMI applications. Choose 5CSEBA4U19C8SN if your design only operates in commercial 0-85C environments and you want lower cost. Choose 5CSEBA5U19C8SN if you anticipate needing more than 40K logic elements (85K LE) in the same footprint. Choose 5CSEBA6U19I7SN if you need both more fabric and a dual-core ARM Cortex-A9 HPS. Avoid migrating between Cyclone V SE and SX families unless you specifically need 3.125 Gbps transceivers - SX variants share package codes but require additional transceiver routing.

Vergleich mit Alternativen

Parameter Dieses Produkt 5CSEBA4U19I7S-N 5CSEBA4U19I7N 5CSEBA4U19I7LN 5CSEBA4U19I7 5CSEBA4U19C8SN 5CSEBA4U19C7SN 5CSEBA5U19C8SN 5CSEBA6U19I7SN
Brand Intel Intel Intel Intel Intel Intel Intel Intel Intel
Package 484-UBGA (19x19) 484-UBGA (19x19) - same 484-UBGA (19x19) - same 484-UBGA (19x19) - same 484-UBGA (19x19) - same 484-UBGA (19x19) - same 484-UBGA (19x19) - same 484-UBGA (19x19) - same 484-UBGA (19x19) - same
Logic Elements 40,000 40,000 40,000 40,000 40,000 40,000 40,000 85,000 110,000
HPS Core Single ARM Cortex-A9 Single ARM Cortex-A9 Single ARM Cortex-A9 Single ARM Cortex-A9 Single ARM Cortex-A9 Single ARM Cortex-A9 Single ARM Cortex-A9 Single ARM Cortex-A9 Dual ARM Cortex-A9
Speed Grade I7 (industrial, fastest) I7N I7N I7LN (low-power) I7 C8 (commercial, fast) C7 (commercial) C8 (commercial, fast) I7
Operating Temperature -40C to +100C (Industrial) -40C to +100C -40C to +100C -40C to +100C -40C to +100C 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) -40C to +100C
HPS Max Frequency 800 MHz 800 MHz 800 MHz 800 MHz 800 MHz 800 MHz 800 MHz 800 MHz 925 MHz
Transceivers None (SE family) None None None None None None None None

Wichtigste Unterscheidungsmerkmale

  • Highest speed grade in 40K LE Cyclone V SE family (vs. 5CSEBA4U19C8SN)
  • Industrial -40C to +100C temperature range (vs. 5CSEBA4U19C8SN)
  • Same-footprint density scaling options available (vs. 5CSEBA5U19C8SN)

Designhinweise

Estimated: The Cyclone V SE SoC FPGA at full HPS load (800 MHz) plus high FPGA utilization typically draws 3-5 W total board power. Decouple the HPS core rail (VCC_HPS) with 22 uF + 4.7 uF + 0.1 uF ceramic capacitors placed within 5 mm of the BGA balls, and replicate this on each FPGA core and I/O bank rail. Use a 6-layer PCB with dedicated power and ground planes to keep impedance below target ripple thresholds; refer to the Cyclone V Device Handbook Pin Connection Guidelines for the full decoupling schedule.

Estimated: The 484 UBG A package uses a 1.0 mm ball pitch on a 19x19 mm body - trace fanout requires microvia HDI PCB technology or a 6-layer stackup with buried vias. Plan escape routing before schematic freeze: HPS pins for DDR3/LPDDR2 must reach the SoC EDS reference layout exactly, since trace-length matching is enforced by Quartus Prime during memory controller calibration. Allocate HPS I/O first (DDR, boot flash, JTAG), then assign FPGA user I/O around the remaining balls.

At continuous HPS load and high FPGA utilization, the 484 UBG A package may need a thermal pad or bottom-side heatsink, especially in industrial environments approaching +100C. Estimate thermal resistance theta_JA from the Cyclone V Device Handbook U19 thermal model; if calculated junction temperature exceeds 105C, attach a 15x15 mm copper pad with thermal vias to a 10x10 mm aluminum heatsink. Use a case-to-ambient thermal sensor for thermal-foldback implementation on the HPS side via the Linux thermal subsystem.

Do not leave HPS boot configuration pins floating - tie MSEL[2:0] to the boot mode (typically 010 for NAND flash or 100 for SD/MMC) through 4.7 kohm resistors. Failing to configure MSEL correctly results in no boot or unpredictable boot path. Also confirm the HPS reset (nHPS_RST) and FPGA configuration done (nCONFIG, nSTATUS, CONF_DONE) signals are properly pulled up per the handbook. JTAG pins TCK, TMS, TDI, TDO must each have a 10 kohm pull-up to VCC_POR (3.3 V) for stable boundary-scan operation.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified at the standard part; functional-safety variants are available separately. Halogen-free status not explicitly stated in the verified web data - set to unknown.

Daten verifiziert am: 2026-09-06 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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