5CSEBA4U19I7LN - 40K LE Cyclone V SoC, Dual ARM Cortex-A9 | Intel
Teilenummer: 5CSEBA4U19I7LN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $225 | $2.250,00 |
| 100 | $198.5 | $19.850,00 |
| 250 | $180 | $45.000,00 |
| 500 | $168 | $84.000,00 |
5CSEBA4U19I7LN Übersicht
A SoC FPGA is a device that merges a hard processor system (HPS) with a programmable logic fabric on one die. Within the broader taxonomy, it sits at the intersection of FPGA & programmable logic and microprocessor & microcontroller products, enabling designers to allocate latency-critical DSP, motor control, or protocol bridging to fabric while running Linux, RTOS, or bare-metal code on the Cortex-A9 cores. The dual-core A9 MPCore subsystem with NEON media engine and single/double-precision FPU accelerates control-plane tasks, while the FPGA fabric handles parallel datapaths.
Key features of the 5CSEBA4U19I7LN include up to 40K logic elements, 224 Kbits of embedded memory (M10K blocks), 56 18x18 multipliers for DSP, and a hardened memory controller supporting DDR2/DDR3/LPDDR2 with ECC. The HPS integrates UART, SPI, I2C, USB 2.0 OTG, EMAC, SD/MMC, NAND flash controller, and GPIO, while the FPGA fabric provides LVDS/CMOS I/O and up to 6 fractional PLLs for clock synthesis.
Architecturally, the device uses a TSMC 28 nm low-power process, a serial configuration scheme via EPCS or quad-serial flash, and supports partial reconfiguration for in-field logic updates. The shared 3.3 V/2.5 V multi-voltage I/O bank structure allows mixed-voltage system integration without external level shifters. Hardware debug is supported through ARM CoreSight ETM/PTM and JTAG.
Typical applications include industrial machine vision, factory automation controllers, motor drive & inverter control, military/aerospace signal processing, broadcast video processing, and secure communications equipment. The combination of processor horsepower and parallel fabric is especially valuable when deterministic latency or high-throughput DSP must coexist with a software stack.
Design consideration: power sequencing of the HPS and FPGA rails must follow the Cyclone V Power Management User Guide to avoid latch-up. Use the Altera/Intel SoC EDS toolchain and configure the HPS boot source (NAND/NOR/SD/eMMC/QSPI) early in BSP bring-up.
This page synthesizes drop-in alternatives, package-compatible swaps, distributor pricing tiers, and practical design notes not found in a single distributor listing or the bare manufacturer datasheet.
Drop-in-Alternativen für 5CSEBA4U19I7LN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA4U19I7LN (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, DSP Blocks, Embedded Memory, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSEBA5U19I7N
✅ Drop-In✓ Auf Lager
$119.85 / Stück
Datenblatt ansehen →5CSEBA6U19I7N
✅ Drop-In✓ Auf Lager
$142.75 / Stück
Datenblatt ansehen →5CSEBA4U19I7N
✅ Drop-In✓ Auf Lager
$72 / Stück
Datenblatt ansehen →5CSEBA5U19C7N
✅ Drop-In✓ Auf Lager
$99.2 / Stück
Datenblatt ansehen →5CSEBA2U19I7N
✅ Drop-In✓ Auf Lager
$445.65 / Stück
Datenblatt ansehen →5CSEBA4U19I7LN Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| FPGA Logic Performance | up to 925 MHz DSP / 300 MHz logic |
| DSP Blocks (18x18 Multipliers) | 56 |
| Memory Controller | DDR2/DDR3/LPDDR2 with ECC (hardened in HPS) |
| HPS Peripherals | UART, SPI, I2C, USB 2.0 OTG, EMAC, SD/MMC, NAND, GPIO |
| Gehäuse | 484-pin UFBGA (19x19 mm, 0.8 mm pitch) |
| Process Technology | TSMC 28 nm low-power |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade, inferred from MPN suffix) |
| Supply Voltage (core) | 1.1 V typical (Cyclone V family) |
| RoHS-Status | Compliant |
| Configuration Scheme | Serial (EPCS) or Quad-Serial Flash |
| Montageart | Surface Mount (BGA) |
5CSEBA4U19I7LN 484-pin ufbga (19x19 mm, 0.8 mm pitch) Pinbelegungsleitfaden
Pinbelegung für 5CSEBA4U19I7LN (484-pin ufbga (19x19 mm, 0.8 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA4U19I7LN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSEBA4U19I7LN ist geeignet für 6 Anwendungs: Industrial Machine Vision, Motor Drive and Inverter Control, Broadcast Video Processing, Military and Aerospace Signal Processing, Factory Automation Controllers, Portable Medical Diagnostic Devices.
Industrial Machine Vision
The 5CSEBA4U19I7LN fits machine vision pipelines because its 40K logic elements plus 56 18x18 DSP multipliers can run Bayer demosaic, Sobel edge detection, and FFT preprocessing at full camera frame rate (typically 60-120 fps at 1080p) in parallel fabric, while the dual-core ARM Cortex-A9 HPS at 925 MHz handles object classification, GigE Vision/USB3 Vision protocol stacks, and Linux user-space orchestration. The hardened DDR3 controller with ECC in the HPS provides a low-latency buffer for line-scan and area-array sensors, and the industrial -40C to +100C junction rating supports factory-floor enclosures. Reference: Intel Cyclone V SoC Development Kit for industrial imaging reference designs.
Empfohlen
Motor Drive and Inverter Control
The 5CSEBA4U19I7LN serves motor control applications by combining FPGA-based field-oriented control (FOC) loops - typically implemented in fabric to achieve sub-microsecond current-loop update rates - with the ARM Cortex-A9 HPS running the velocity/torque loop, CANopen or EtherCAT master stack, and HMI. The 56 DSP multipliers accelerate Park/Clarke transforms and SVM modulation, while the 925 MHz Cortex-A9 HPS peripherals include EMAC for EtherCAT and CAN for legacy industrial buses. Industrial temperature grade and the hardened memory controller with ECC ensure reliable operation across inverter ambient conditions.
Empfohlen
Broadcast Video Processing
The 5CSEBA4U19I7LN is well matched to broadcast video workloads where the FPGA fabric handles SDI de/serialization, color space conversion, scaling, and genlock at low latency, while the dual-core ARM Cortex-A9 HPS runs the control plane for video routing, ancillary data extraction, and SNMP/JSON management. The 40K logic elements and LVDS I/O banks support multi-channel 3G-SDI I/O, and the 56 DSP multipliers accelerate chroma resampling. The 484-UFBGA package supports multi-layer PCB stackups needed for controlled-impedance SDI traces.
Empfohlen
Military and Aerospace Signal Processing
The 5CSEBA4U19I7LN suits defense signal-processing applications because the hardened dual-core ARM Cortex-A9 MPCore with CoreSight provides SWaP-optimized heterogeneous compute, while the FPGA fabric handles radar DSP, software-defined radio baseband, or secure communications link layers. Industrial temperature grade (I7) and the 28 nm low-power process support size, weight, and power envelopes typical of unmanned systems. The device is widely used in DO-254 and MIL-STD-810 programs; reference Intel Cyclone V military-grade qualification packages for design assurance.
Empfohlen
Factory Automation Controllers
The 5CSEBA4U19I7LN enables compact Programmable Automation Controllers (PACs) by running real-time EtherCAT, PROFINET, or Modbus TCP stacks on the Cortex-A9 HPS while offloading deterministic I/O scanning, PWM, encoder decoding, and high-speed counter functions to fabric. The 40K logic elements are sufficient for 8-16 axis servo control with custom feedback loops, and the HPS peripherals include EMAC, USB, SD/MMC, and SPI for HMI and storage. The 484-UFBGA package keeps the controller PCB compact while supporting industrial EMC standards.
Empfohlen
Portable Medical Diagnostic Devices
The 5CSEBA4U19I7LN supports portable ultrasound, patient monitoring, and point-of-care diagnostic equipment by partitioning real-time DSP (beamforming, FIR filtering, FFT) onto the FPGA fabric while the Cortex-A9 HPS runs the user interface, network stack (TCP/IP, Wi-Fi via USB), and clinical data encryption. The 28 nm low-power process keeps the device's power envelope compatible with battery operation, and the integrated DDR3 controller with ECC preserves data integrity for diagnostic images. The industrial temperature grade supports clinical and field environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSEBA4U19I7LN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSEBA5U19I7N | 5CSEBA6U19I7N | 5CSEBA4U19I7N | 5CSEBA5U19C7N | 5CSEBA2U19I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin UFBGA (19x19 mm) | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same |
| Logic Elements | 40K | 85K | 110K | 40K | 85K | 25K |
| HPS Processor | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 925 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial (0C to +85C) | Industrial |
| DSP (18x18 Multipliers) | 56 | 87 | 112 | 56 | 87 | 36 |
| Hard Memory Controller | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Balanced 40K logic + dual-core Cortex-A9 HPS at 925 MHz on same die (vs. 5CSEBA2U19I7N)
- Industrial -40C to +100C operating range with hardened memory controller (vs. 5CSEBA5U19C7N)
- Wide ecosystem support: Quartus Prime, SoC EDS, ARM DS-5, Linux 6.x LTS (vs. Xilinx Zynq-7000 family)
Designhinweise
The 5CSEBA4U19I7LN requires multi-rail sequencing: 3.3 V VCCPD must ramp before or together with VCCIO, and VCC (1.1 V core) must come up after the I/O rails. Intel's Cyclone V Power Management User Guide specifies a maximum delta of 200 mV between rails during ramp. Use a dedicated power sequencer IC (e.g., LTC2923-class) or the SoC EDS preloader to enforce sequencing. Decouple each VCC/VCCIO/VCCPD domain with 0.1 uF + 10 uF ceramic capacitors within 5 mm of each pin, and add bulk capacitance on the 1.0 V HPS core and 1.5 V DDR supply to handle HPS-to-FPGA bus bursts.
Estimated: at full HPS (1.5 W) and 40K-LE fabric utilization at 300 MHz (approximately 1.2 W) the 5CSEBA4U19I7LN dissipates about 2.7 W total. The 484-UFBGA has a theta_JA of roughly 13 C/W on a 4-layer JEDEC JESD51 test board, yielding a 35 C rise above ambient - comfortable for industrial 100 C operation. For enclosed designs, place thermal vias in the BGA land pattern and consider a 30x30 mm copper spreader. Use Quartus Prime's PowerPlay early power estimator for accurate per-design budget.
The 484-UFBGA package uses 0.8 mm pitch; route with microvia (laser-drilled) stackups rather than through-via dog-bones to escape the inner rows. Maintain 50 ohm controlled impedance for LVDS pairs used by FPGA transceivers, and 100 ohm differential for HPS RGMII. Reference Intel's Cyclone V SoC Board Design Guidelines for DDR3 trace matching (within 25 ps skew), length-matched HPS-to-FPGA bridges (lightweight HPS-to-FPGA AXI bus), and the recommended 8-layer stackup. Add a low-ESR 0402 0.1 uF cap under each FPGA quadrant for high-frequency decoupling.
Three pitfalls to avoid on 5CSEBA4U19I7LN designs: (1) The HPS boot pins MSEL[2:0] and BSEL must be tied to the correct mode (000 = NAND, 001 = SD/MMC, 100 = QSPI) - a mismatch silently bricks the boot flow; verify with the SoC EDS preloader generator. (2) Do not enable both HPS and FPGA core supplies simultaneously without sequencing, as back-powering through the HPS-to-FPGA bridges can latch up the HPS. (3) The JTAG chain must include both the HPS TAP (ARM CoreSight) and the FPGA TAP - a missing HPS TAP blocks DS-5 debugger attach even when FPGA JTAG works.
Compliance-Informationen
RoHS and lead-free per Cyclone V family datasheet; AEC-Q100 not applicable for industrial-grade SoC FPGA. For halogen-free status consult the Intel Material Declaration.
