5CSEBA4U23C7SN vs 5CSEBA4U23C8N Vergleich
Detaillierter Direktvergleich von 5CSEBA4U23C7SN von Intel und 5CSEBA4U23C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ AktivIntel
5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C8N ✓ AktivSpezifikationsvergleich
| Parameter | 5CSEBA4U23C7SN | 5CSEBA4U23C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,20 | $138,20 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Logic Elements | 40,000 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 800 MHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Kbits) | 2,460 | — |
| DSP Blocks (18x18) | 112 | — |
| Maximum User I/Os | 364 | — |
| Gehäuse | 672-ball UBGA, 23x23 mm | 672-pin UBGA (UBGA-672, 23x23 mm) |
| Ball Pitch | 0.8 mm | — |
| Process Node | TSMC 28 nm low-power | — |
| Betriebstemperatur | -40C to +85C (industrial) | [DATA_NEEDED: industrial Tj range] |
| Memory Interfaces | DDR2, DDR3, LPDDR2 (hard controller) | — |
| Peripherals (HPS) | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART | — |
| Configuration Modes | JTAG, serial passive/active | — |
| Speed Grade | C7 | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 40,000 |
| Processor Core | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | — | 600 MHz |
| Embedded Memory | — | [DATA_NEEDED: total Kbits] |
| DSP Blocks | — | [DATA_NEEDED: variable-precision DSP count] |
| Multipliers | — | 18x18 dedicated multipliers |
| Maximum User I/O | — | 188 |
| Process Technology | — | TSMC 28 nm low-power |
| HPS Peripherals | — | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC |
| Memory Controller (HPS) | — | DDR3/DDR3L/LPDDR2 with hard PHY |
| Montageart | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |