5CSEBA4U23C7SN vs 5CSEBA4U23C8N Comparaison
Comparaison détaillée côte à côte de 5CSEBA4U23C7SN par Intel et 5CSEBA4U23C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ ActifIntel
5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C8N ✓ ActifComparaison des spécifications
| Paramètre | 5CSEBA4U23C7SN | 5CSEBA4U23C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $18,20 | $138,20 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Logic Elements | 40,000 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 800 MHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Kbits) | 2,460 | — |
| DSP Blocks (18x18) | 112 | — |
| Maximum User I/Os | 364 | — |
| Boîtier | 672-ball UBGA, 23x23 mm | 672-pin UBGA (UBGA-672, 23x23 mm) |
| Ball Pitch | 0.8 mm | — |
| Process Node | TSMC 28 nm low-power | — |
| Température de fonctionnement | -40C to +85C (industrial) | [DATA_NEEDED: industrial Tj range] |
| Memory Interfaces | DDR2, DDR3, LPDDR2 (hard controller) | — |
| Peripherals (HPS) | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART | — |
| Configuration Modes | JTAG, serial passive/active | — |
| Speed Grade | C7 | — |
| Statut RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 40,000 |
| Processor Core | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | — | 600 MHz |
| Embedded Memory | — | [DATA_NEEDED: total Kbits] |
| DSP Blocks | — | [DATA_NEEDED: variable-precision DSP count] |
| Multipliers | — | 18x18 dedicated multipliers |
| Maximum User I/O | — | 188 |
| Process Technology | — | TSMC 28 nm low-power |
| HPS Peripherals | — | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC |
| Memory Controller (HPS) | — | DDR3/DDR3L/LPDDR2 with hard PHY |
| Type de montage | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |