5CSEBA4U23C7SN vs 5CSEBA4U23C8N Comparação
Comparação detalhada lado a lado de 5CSEBA4U23C7SN por Intel e 5CSEBA4U23C8N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ AtivoIntel
5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C8N ✓ AtivoComparação de especificações
| Parâmetro | 5CSEBA4U23C7SN | 5CSEBA4U23C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $18,20 | $138,20 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Logic Elements | 40,000 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 800 MHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Kbits) | 2,460 | — |
| DSP Blocks (18x18) | 112 | — |
| Maximum User I/Os | 364 | — |
| Encapsulamento | 672-ball UBGA, 23x23 mm | 672-pin UBGA (UBGA-672, 23x23 mm) |
| Ball Pitch | 0.8 mm | — |
| Process Node | TSMC 28 nm low-power | — |
| Temperatura de operação | -40C to +85C (industrial) | [DATA_NEEDED: industrial Tj range] |
| Memory Interfaces | DDR2, DDR3, LPDDR2 (hard controller) | — |
| Peripherals (HPS) | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART | — |
| Configuration Modes | JTAG, serial passive/active | — |
| Speed Grade | C7 | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 40,000 |
| Processor Core | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | — | 600 MHz |
| Embedded Memory | — | [DATA_NEEDED: total Kbits] |
| DSP Blocks | — | [DATA_NEEDED: variable-precision DSP count] |
| Multipliers | — | 18x18 dedicated multipliers |
| Maximum User I/O | — | 188 |
| Process Technology | — | TSMC 28 nm low-power |
| HPS Peripherals | — | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC |
| Memory Controller (HPS) | — | DDR3/DDR3L/LPDDR2 with hard PHY |
| Tipo de montagem | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |