5CSEBA5U19A7N vs 5CSEBA4U19A7N Vergleich

Detaillierter Direktvergleich von 5CSEBA5U19A7N von Intel und 5CSEBA4U19A7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 5CSEBA5U19A7N 5CSEBA4U19A7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $152,40 $99,90
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 85,000 40 K
Process Technology 28 nm low-power —
Hard Processor System (HPS) Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Frequency 700 MHz —
Gehäuse 484-pin UBG A (19x19 mm) 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
Montageart Surface Mount (BGA) Surface Mount (BGA)
Supply Voltage (Core) 1.1 V —
Operating Temperature Grade Automotive (AEC-Q100) -40C to +125C —
I/O Count 66 (per source listing) —
Memory Interface DDR3 controller in HPS; external memory interface in FPGA fabric —
DSP Blocks Variable-precision DSP blocks —
Configuration / Boot Modes NAND, QSPI, SD/MMC —
RoHS-Status Compliant (per Ampheo listing) Compliant
Automotive Qualification AEC-Q100 (Automotive grade, indicated by 'A' in part number) —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
Embedded Memory — 3.4 Mbits (M9K)
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Betriebs-Sperrschichttemperatur — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Core Voltage — 1.1 V (typical)
MSL-Level — 3 (168 hours)

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