5CSEBA4U19A7N - Cyclone V SE SoC FPGA, 40K LE, 484-UBGA | Intel
Teilenummer: 5CSEBA4U19A7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $147.21 | $147,21 |
| 10 | $138.5 | $1.385,00 |
| 100 | $124.8 | $12.480,00 |
| 500 | $112.4 | $56.200,00 |
| 1.000 | $99.9 | $99.900,00 |
5CSEBA4U19A7N Übersicht
A System-on-Chip FPGA is a heterogeneous compute device that combines a hard-application processor subsystem (HPS) with a programmable logic fabric on a single silicon die, enabling deterministic hardware acceleration alongside rich software stacks. The HPS-to-FPGA bridges (AXI-32, AXI-64, AXI-128) allow latency-critical control loops to be offloaded to custom logic while the Cortex-A9 cores run Linux or RTOS workloads, eliminating the need for a discrete host processor and reducing board area, BOM cost, and inter-chip latency.
Key features include approximately 40K logic elements, 224 18x18 multipliers, 3.4 Mbits of embedded memory, dual ARM Cortex-A9 MPCore at up to 925 MHz (speed-grade dependent), hard DDR3 controller with ECC, integrated PLL and clock tree, and a single 3.0 V core power rail. The SE variant is optimized for lowest static power while keeping transceiver logic available.
The fabric uses a TSMC 28 nm low-power process with adaptive logic modules (ALMs), 8-input fracturable look-up tables, and variable-precision DSP blocks. Embedded memory blocks (M9K) operate up to 274 MHz and can be configured as single-port, dual-port, or FIFO with byte-enable support for efficient buffer management.
Typical applications include industrial motor control, factory automation HMIs, machine vision edge nodes, automotive driver assistance, medical imaging preprocessing, and ruggedized military communications. The combination of an ARM host processor with programmable logic makes the device especially attractive for smart-camera and sensor-fusion appliances that require both deterministic hardware pipelines and a Linux software stack.
When designing with this device, follow Intel's PowerPlay early power estimation workflow before PCB layout: the FPGA and HPS each require independent decoupling schemes, and the 484-UBGA package demands 1.0 mm pitch fan-out with microvia stack-ups on at least 6 PCB layers.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on individual distributor listings, giving engineers a single decision-ready view of the 5CSEBA4U19A7N for SoC FPGA selection and second-source planning.
Drop-in-Alternativen für 5CSEBA4U19A7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA4U19A7N (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Operating Temperature, Process Technology, DSP Blocks.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSEBA5U19A7N
✅ Drop-In✓ Auf Lager
$152.4 / Stück
Datenblatt ansehen →5CSEBA2U19A7N
✅ Drop-In✓ Auf Lager
$92.1 / Stück
Datenblatt ansehen →5CSEBA2U23A7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$99.5 / Stück
Datenblatt ansehen →5CGTFD9A5U19A7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$241.5 / Stück
Datenblatt ansehen →5CSEBA4U19A7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SE SoC FPGA |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 40 K |
| Embedded Memory | 3.4 Mbits (M9K) |
| DSP Blocks (18x18 Multipliers) | 224 |
| HPS Maximum Application Clock | 925 MHz |
| Memory Interfaces | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA |
| User I/O | 161 |
| Gehäuse | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| Montageart | Surface Mount (BGA) |
| Betriebs-Sperrschichttemperatur | -40C to +125C (automotive) / -40C to +100C (industrial) |
| Process Node | TSMC 28 nm low-power |
| Core Voltage | 1.1 V (typical) |
| RoHS-Status | Compliant |
| MSL-Level | 3 (168 hours) |
5CSEBA4U19A7N 484-ubga (u19), 19x19 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für 5CSEBA4U19A7N (484-ubga (u19), 19x19 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA4U19A7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSEBA4U19A7N ist geeignet für 6 Anwendungs: Industrial Motor Control, Machine Vision Edge Nodes, Automotive Driver Assistance (ADAS), Medical Imaging Preprocessing, Rugged Military Communications, Smart HMI Panels.
Industrial Motor Control
The 5CSEBA4U19A7N is well-suited for industrial motor controllers because its dual ARM Cortex-A9 MPCore cores run Linux or RTOS-based supervisory loops while the 40K-logic-element Cyclone V FPGA fabric accelerates deterministic current-loop and PWM generation. The hard DDR3 controller with ECC supports 32-bit memory transactions, and the 161 user I/O pins provide flexible encoder, resolver, and gate-driver interfaces for multi-axis drives.
Empfohlen
Machine Vision Edge Nodes
For machine vision edge nodes, the 5CSEBA4U19A7N pairs its dual 925 MHz ARM cores for image pre-processing and network connectivity with FPGA fabric acceleration for image-pipeline operations. The 224 18x18 multipliers deliver DSP bandwidth for convolution and Sobel filters, while the 3.4 Mbit embedded memory provides on-chip line buffers reducing external DDR bandwidth. Power consumption stays low thanks to the 28 nm low-power process.
Empfohlen
Automotive Driver Assistance (ADAS)
In ADAS sensor-fusion appliances, the 5CSEBA4U19A7N automotive-grade operating range to +125C junction and its AEC-Q-style Cyclone V qualification path make it a strong host for camera and radar pre-processing. The ARM Cortex-A9 cores run perception stacks while the FPGA fabric implements low-latency object detection pipelines. Hardware SEU mitigation via ECC memory and CRC scrubbing is supported in the Quartus tool flow.
Empfohlen
Medical Imaging Preprocessing
The 5CSEBA4U19A7N enables medical imaging subsystems to combine ARM Cortex-A9 host processing for DICOM handling and user interface with FPGA-accelerated FIR filtering and pixel-pipeline operations. The 161 user I/O accommodates Camera Link or LVDS camera interfaces, and the hard DDR3 controller manages frame-buffer memory. The 484-UBGA package supports the small form factors required for portable and cart-based equipment.
Empfohlen
Rugged Military Communications
For ruggedized tactical radios, the 5CSEBA4U19A7N provides ARM Cortex-A9 cores for protocol stack management and the Cyclone V FPGA fabric for modem PHY and crypto-acceleration offload. The wide industrial temperature range, BGA package reliability under shock and vibration, and DDR3 controller with ECC for high-altitude radiation hardening via software scrubbing make it well-suited to defense applications.
Empfohlen
Smart HMI Panels
Smart HMI panels benefit from the 5CSEBA4U19A7N's dual ARM Cortex-A9 cores running Linux-based GUI frameworks like Qt alongside FPGA-accelerated display refresh, touch processing, and backlight control. The 3.4 Mbit embedded memory can buffer frame layers, and the 161 user I/O interfaces easily to LVDS or RGB LCD panels, capacitive touch controllers, and industrial fieldbus peripherals in panel-mount enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSEBA4U19A7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSEBA5U19A7N | 5CSEBA2U19A7N | 5CSEBA2U23A7N | 5CGTFD9A5U19A7N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-UBGA (U19), 19x19 mm | 484-UBGA (U19), 19x19 mm - same | 484-UBGA (U19), 19x19 mm - same | 484-UBGA (U23), 23x23 mm - larger | 484-UBGA (U19), 19x19 mm - same |
| Logic Elements | 40K | 85K (+112%) | 25K (-38%) | 25K (-38%) | 300K (+650%) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same |
| Maximum HPS Clock | 925 MHz | 925 MHz - same | 925 MHz - same | 925 MHz - same | 925 MHz - same |
| Memory Controller | DDR3/DDR3L/LPDDR2 with ECC | DDR3/DDR3L/LPDDR2 with ECC - same | DDR3/DDR3L/LPDDR2 with ECC - same | DDR3/DDR3L/LPDDR2 with ECC - same | DDR3/DDR3L/LPDDR2 with ECC - same |
Wichtigste Unterscheidungsmerkmale
- Higher DSP density than lower-tier Cyclone V SE variants (vs. 5CSEBA2U19A7N)
- Smaller package footprint than U23 alternatives (vs. 5CSEBA2U23A7N)
- Cost-optimized versus higher-density Cyclone V SE A5 (vs. 5CSEBA5U19A7N)
Designhinweise
The 484-UBGA package uses a 1.0 mm ball pitch, which is at the threshold of standard 4-mil dry-film PCB manufacturing. Use laser-drilled microvias (4-6 mil capture pads, 8-10 mil drill) and HDI stack-ups with at least 1-2-1 or 2-4-2 build-up layers on the top and bottom. Escape routing on the top layer should fan-out to break-out vias on a 1.2 mm grid, with the remaining traces routed on inner signal layers.
Estimated: at typical industrial SoC FPGA utilization of 60% logic, 50% DSP, and 100% HPS at 925 MHz, the 5CSEBA4U19A7N draws approximately 4-6 W from the 1.1 V core rail. Use a 4-layer PCB with a dedicated 1.1 V plane; place 0402 0.1 uF X7R decoupling caps within 100 mil of every VCC/VCCIO ball pair, plus 10 uF bulk caps every 5-8 mm along the power plane.
The 484-UBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W on a JEDEC 4-layer test board. At 5 W dissipation this yields a 60-75 C rise above ambient, which is fine for industrial applications but may require a heat spreader or forced airflow for automotive +125C junction operation. Use the Quartus PowerPlay early power estimator before committing to a cooling solution.
Do not assume that the same bitstream works across A4 and A5 family variants despite the identical U19 package footprint. The 5CSEBA4U19A7N requires a Quartus Prime compilation targeting the 40K-LE density, and migrating to A5 requires a recompile with the larger device selected. Mixing part numbers across a single production panel can cause configuration failures that are difficult to diagnose in the field.
Compliance-Informationen
RoHS and REACH compliance confirmed on Intel Cyclone V family datasheet. AEC-Q100 grade availability is part-number dependent; check -I7N / -I7SN / -A7N suffixes for industrial or automotive temperature grades. Cyclone V SoC FPGAs are manufactured on a TSMC 28 nm low-power process.
