900-13767-0000-0A1 vs 900-13767-0000-0A0 Vergleich

Detaillierter Direktvergleich von 900-13767-0000-0A1 von NVIDIA und 900-13767-0000-0A0 von NVIDIA. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 900-13767-0000-0A1 900-13767-0000-0A0
Marke NVIDIA NVIDIA
Kategorie Development Boards Wireless Modules
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $549,00 $499,00
Module Type System-on-Module (SOM) —
Product Family NVIDIA Jetson Orin NX —
AI Performance 100 TOPS (INT8) Up to 100 TOPS (INT8 sparse)
GPU 1024-core NVIDIA Ampere with Tensor Cores 1024-core NVIDIA Ampere with 32 Tensor cores
CPU 8-core Arm Cortex-A78AE 64-bit 8-core ARM Cortex-A78AE 64-bit
Memory 16 GB LPDDR5 16 GB LPDDR5
Memory Bandwidth 102 GB/s 102.4 GB/s
Storage External via carrier (no on-module eMMC) External (via carrier board)
Video Decode 2x NVDEC —
Video Encode 1x NVENC —
PCIe PCIe Gen 4.0 x4 PCIe Gen 4 (x1/x2/x4 lanes available)
Camera Interfaces 2x MIPI CSI-2 (4-lane) Up to 6 MIPI CSI-2 lanes (2x4-lane or 4x2-lane)
Configurable TDP 10 W to 25 W —
Form Factor 70 mm x 45 mm (260-pin SO-DIMM connector) 69.6 mm x 45 mm SOM
Betriebstemperatur -25C to +80C (industrial modules vary) -25C to +80C (module)
TAA/NDAA Compliance Yes (US Country of Origin) —
COO Suffix 0A1 = USA (0A0 = Taiwan, 000 = China per EMAC inc.) —
RoHS-Status Compliant (NVIDIA Jetson module product page) Compliant
Product Type — System-on-Module (SOM)
Power Envelope — 10 W to 25 W (configurable)
Module Connector — 260-pin SO-DIMM edge connector
USB — USB 3.2 Gen 2
Display — 1x HDMI 2.1 (via carrier)
Networking — 1x GbE (via carrier)
Country of Origin — USA
TAA Compliance — Yes (TAA/NDAA compliant)
Software Support — NVIDIA JetPack SDK, CUDA, TensorRT, DeepStream

Datenblätter & Ressourcen

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