900-13767-0000-0A1 vs 900-13767-0000-0A0 对比
详细并排对比 900-13767-0000-0A1 出自 NVIDIA 和 900-13767-0000-0A0 出自 NVIDIA。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 900-13767-0000-0A1 | 900-13767-0000-0A0 |
|---|---|---|
| 品牌 | NVIDIA | NVIDIA |
| 分类 | Development Boards | Wireless Modules |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $549.00 | $499.00 |
| Module Type | System-on-Module (SOM) | — |
| Product Family | NVIDIA Jetson Orin NX | — |
| AI Performance | 100 TOPS (INT8) | Up to 100 TOPS (INT8 sparse) |
| GPU | 1024-core NVIDIA Ampere with Tensor Cores | 1024-core NVIDIA Ampere with 32 Tensor cores |
| CPU | 8-core Arm Cortex-A78AE 64-bit | 8-core ARM Cortex-A78AE 64-bit |
| Memory | 16 GB LPDDR5 | 16 GB LPDDR5 |
| Memory Bandwidth | 102 GB/s | 102.4 GB/s |
| Storage | External via carrier (no on-module eMMC) | External (via carrier board) |
| Video Decode | 2x NVDEC | — |
| Video Encode | 1x NVENC | — |
| PCIe | PCIe Gen 4.0 x4 | PCIe Gen 4 (x1/x2/x4 lanes available) |
| Camera Interfaces | 2x MIPI CSI-2 (4-lane) | Up to 6 MIPI CSI-2 lanes (2x4-lane or 4x2-lane) |
| Configurable TDP | 10 W to 25 W | — |
| Form Factor | 70 mm x 45 mm (260-pin SO-DIMM connector) | 69.6 mm x 45 mm SOM |
| 工作温度 | -25C to +80C (industrial modules vary) | -25C to +80C (module) |
| TAA/NDAA Compliance | Yes (US Country of Origin) | — |
| COO Suffix | 0A1 = USA (0A0 = Taiwan, 000 = China per EMAC inc.) | — |
| RoHS 状态 | Compliant (NVIDIA Jetson module product page) | Compliant |
| Product Type | — | System-on-Module (SOM) |
| Power Envelope | — | 10 W to 25 W (configurable) |
| Module Connector | — | 260-pin SO-DIMM edge connector |
| USB | — | USB 3.2 Gen 2 |
| Display | — | 1x HDMI 2.1 (via carrier) |
| Networking | — | 1x GbE (via carrier) |
| Country of Origin | — | USA |
| TAA Compliance | — | Yes (TAA/NDAA compliant) |
| Software Support | — | NVIDIA JetPack SDK, CUDA, TensorRT, DeepStream |