A3P600-1FGG144I vs A3P600-2FGG144 Vergleich
Detaillierter Direktvergleich von A3P600-1FGG144I von Microchip Technology und A3P600-2FGG144 von Microsemi. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P600-1FGG144I - ProASIC3 FPGA, 600K Gates | Microchip
A3P600-1FGG144I ✓ Aktiv
Spezifikationsvergleich
| Parameter | A3P600-1FGG144I | A3P600-2FGG144 |
|---|---|---|
| Marke | Microchip Technology | Microsemi |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $45,00 | $30,40 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600000 | — |
| Logic Elements (LEs) | 13824 | — |
| D-Flip-Flops | 13824 | — |
| RAM Bits | 110592 | — |
| User I/Os | 97 | — |
| Number of PLLs | 1 | — |
| Core Supply Voltage | 1.5 V | — |
| I/O Standards Supported | 3.3V, 2.5V, 1.8V, 1.5V | — |
| Maximum System Performance | 272 MHz | — |
| Maximum Internal Clock Frequency | 350 MHz | — |
| Gehäuse | 144-LBGA (13x13 mm, 0.8 mm pitch) | 144-Ball FBGA (FGG144) |
| Betriebstemperaturbereich | -40°C to +100°C (industrial) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Technology | 130nm Flash | — |
| Equivalent Gate Count | — | 600000 gates |
| Logic Cells (CLBs) | — | 13824 CLBs |
| User I/O | — | 97 I/O |
| System Performance | — | 310 MHz |
| Process Technology | — | 130 nm CMOS |
| Core Voltage | — | 1.5 V |
| Program Technology | — | Nonvolatile Flash |
| Ball Pitch | — | 1 mm |
| Packaging | — | Tray |
| Speed Grade | — | -2 |
| Configuration | — | Single-chip, Instant On, no external boot device |
| I/O Banks | — | 4 (independently supplied VCCIB banks) |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |