A3P600-2FGG144 vs A3P250-2FGG144 Vergleich
Detaillierter Direktvergleich von A3P600-2FGG144 von Microsemi und A3P250-2FGG144 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P250-2FGG144 - ProASIC3 Flash FPGA 250K Gates | Microchip
A3P250-2FGG144 ✓ AktivSpezifikationsvergleich
| Parameter | A3P600-2FGG144 | A3P250-2FGG144 |
|---|---|---|
| Marke | Microsemi | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $30,40 | $27,80 |
| Family | ProASIC3 | ProASIC3 Flash FPGA |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Core Voltage | 1.5 V | — |
| Program Technology | Nonvolatile Flash | — |
| Gehäuse | 144-Ball FBGA (FGG144) | 144-LBGA (FBGA-144) |
| Ball Pitch | 1 mm | — |
| Montageart | Surface Mount | — |
| Packaging | Tray | Tray |
| Speed Grade | -2 | -2 |
| Configuration | Single-chip, Instant On, no external boot device | — |
| I/O Banks | 4 (independently supplied VCCIB banks) | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| System Gates | — | 250K |
| User I/Os | — | 97 |
| Configuration Memory | — | 36864 (on-chip flash) |
| Maximum System Performance | — | 310 MHz |
| Core Supply Voltage | — | 1.5 V |
| Montagestil | — | SMD/SMT |
| Operating Temperature (Min) | — | 0 C |
| Operating Temperature (Max) | — | +70 C |
| Soft ARM Support | — | Yes (optional, ProASIC3 family) |
| Configuration Type | — | Flash (single-chip, live at power-up) |
| Reprogrammability | — | Yes (in-system reprogrammable) |