A3P600-2FGG256 vs A3P600-FGG256I Vergleich
Detaillierter Direktvergleich von A3P600-2FGG256 von Microchip Technology und A3P600-FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P600-2FGG256 - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-2FGG256 ✓ AktivMicrochip Technology
A3P600-FGG256I - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | A3P600-2FGG256 | A3P600-FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $50,51 | $96,23 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600K |
| Logic Elements | VersaTiles (ProASIC3 fabric) | — |
| Embedded RAM | 110592 bits | 110592 bits |
| User I/O | 177 | 177 |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum System Frequency | 310 MHz | 231 MHz |
| Process Technology | 130 nm flash | 130 nm |
| Speed Grade | -2 | — |
| Configuration Memory | On-chip flash (nonvolatile, single chip) | — |
| I/O Banks | 4 | 4 |
| Gehäuse | 256-LBGA / 256-FBGA | 256-Ball FBGA (FGG256) |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | Ball (BGA), square package | — |
| Temperature Grading | Commercial [DATA_NEEDED: exact operating temperature range] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Logic Elements (D-Registers) | — | 13824 |
| Configuration Technology | — | Flash (nonvolatile, single-chip) |
| Betriebstemperatur | — | -40C to +85C |
| Lead-Free | — | Yes |
| Typical Applications | — | Signal processing, industrial automation, communications, hardware acceleration |