A3P600-2FGG256 vs A3P600-FGG256I 비교
다음의 상세 나란히 비교: A3P600-2FGG256 제조: Microchip Technology 및 A3P600-FGG256I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
A3P600-2FGG256 - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-2FGG256 ✓ 활성Microchip Technology
A3P600-FGG256I - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-FGG256I ✓ 활성사양 비교
| 파라미터 | A3P600-2FGG256 | A3P600-FGG256I |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $50.51 | $96.23 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600K |
| Logic Elements | VersaTiles (ProASIC3 fabric) | — |
| Embedded RAM | 110592 bits | 110592 bits |
| User I/O | 177 | 177 |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum System Frequency | 310 MHz | 231 MHz |
| Process Technology | 130 nm flash | 130 nm |
| Speed Grade | -2 | — |
| Configuration Memory | On-chip flash (nonvolatile, single chip) | — |
| I/O Banks | 4 | 4 |
| 패키지 | 256-LBGA / 256-FBGA | 256-Ball FBGA (FGG256) |
| 실장 유형 | Surface Mount | Surface Mount |
| Terminal Form | Ball (BGA), square package | — |
| Temperature Grading | Commercial [DATA_NEEDED: exact operating temperature range] | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | Compliant |
| Logic Elements (D-Registers) | — | 13824 |
| Configuration Technology | — | Flash (nonvolatile, single-chip) |
| 동작 온도 | — | -40C to +85C |
| Lead-Free | — | Yes |
| Typical Applications | — | Signal processing, industrial automation, communications, hardware acceleration |