A3P600-FG256 vs M1AFS1500-2FGG256 Vergleich
Detaillierter Direktvergleich von A3P600-FG256 von Microchip Technology und M1AFS1500-2FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ AktivMicrochip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ AktivSpezifikationsvergleich
| Parameter | A3P600-FG256 | M1AFS1500-2FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $48,90 | $124,50 |
| Family | ProASIC3 (Flash FPGAs) | — |
| System Gates | 600000 | 1,500,000 |
| Logic Elements | 7K LEs (VersaTiles) | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| User I/O | 177 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Maximum System Performance | Approx. 231 MHz | — |
| Configuration Technology | On-chip flash, reprogrammable, single-chip | — |
| Power-Up Behavior | Instant On Level 0 support | — |
| Gehäuse | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | 0 C to 85 C (TJ) | — |
| I/O Banks | 4 (independent VCCIBx supplies) | — |
| Packaging | Tray | Tray |
| RoHS-Status | RoHS non-compliant (per Microchip USA listing) | — |
| Manufacturer Lead Time | 8 weeks | — |
| Series | — | M1AFS1500 (Fusion) |
| Logic Cells | — | 38,400 |
| Embedded Processor | — | ARM Cortex-M1 |
| Maximale Taktfrequenz | — | 350 MHz |
| Number of I/O | — | 119 |
| Betriebsversorgungsspannung | — | 1.5 V |
| Flash Memory Bits (reported) | — | 276480 |
| Technology | — | CMOS, 130nm class |
| Speed Grade | — | -2 |
| Gehäuse / Bauform | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Montagestil | — | SMD/SMT |
| Betriebstemperaturbereich | — | 0C to +70C |
| Analog Blocks | — | Configurable analog (Fusion mixed-signal architecture) |
| Programming Type | — | Flash-based (in-system programmable) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Total RAM Blocks | — | [DATA_NEEDED: RAM block count] |